The recommended land pattern for LBR2012T1R0M is a rectangular pad with a size of 1.2mm x 0.8mm, with a solder mask opening of 0.5mm x 0.5mm.
While LBR2012T1R0M is rated for operation up to 125°C, it's not recommended for continuous use above 105°C. If your application requires high-temperature operation, consider using a different component or consulting with a TAIYO YUDEN representative.
Handle the component by the edges to prevent damage to the termination. Avoid touching the component's surface, as the oils from your skin can affect solderability. Use a vacuum pickup or tweezers to handle the component during assembly.
The MSL of LBR2012T1R0M is 3, which means it can be exposed to a relative humidity of 60% or less at 30°C for up to 168 hours without being baked.
While LBR2012T1R0M is designed to withstand some vibration, it's not recommended for applications with extreme vibration. If your application requires high vibration resistance, consider using a different component or consulting with a TAIYO YUDEN representative.
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LBR2012T1R0M Overview
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