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LC717A00AJ-AH - onsemi

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LC717A00AJ-AH - onsemi PCB footprint - Small Outline Packages - Small Outline Packages - SSOP30(225MIL) 3421
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LC717A00AJ-AH - onsemi  - 3D model - Small Outline Packages - SSOP30(225MIL) 3421
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LC717A00AJ-AH Details

  • Manufacturer Part Number:

    LC717A00AJ-AH

  • Brand Name:

    ON Semiconductor

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Package Description:

    SSOP-30

  • Pin Count:

    30

  • Manufacturer Package Code:

    565AZ

  • HTS Code:

    8542.39.00.01

  • Factory Lead Time:

    4 Weeks

  • Manufacturer:

    onsemi

  • YTEOL:

    0

  • Analog IC - Other Type:

    ANALOG CIRCUIT

  • JESD-30 Code:

    R-PDSO-G30

  • JESD-609 Code:

    e6

  • Length:

    8.25 mm

  • Moisture Sensitivity Level:

    3

  • Number of Functions:

    1

  • Number of Terminals:

    30

  • Operating Temperature-Max:

    105 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    LSSOP

  • Package Equivalence Code:

    SSOP30,.25,20

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Seated Height-Max:

    1.7 mm

  • Supply Voltage-Max (Vsup):

    5.5 V

  • Supply Voltage-Min (Vsup):

    2.6 V

  • Supply Voltage-Nom (Vsup):

    2.8 V

  • Surface Mount:

    YES

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    TIN BISMUTH

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    4.4 mm

LC717A00AJ-AH Frequently Asked Questions (FAQs)

  • A good PCB layout for the LC717A00AJ-AH involves keeping the analog and digital grounds separate, using a solid ground plane, and placing the device close to the analog signal sources. Additionally, it's recommended to use a 4-layer PCB with a dedicated power plane and to avoid routing digital signals under the device.
  • To ensure accurate temperature measurement, it's essential to follow proper thermal design guidelines, such as placing the device close to the thermal source, using a thermal pad or heat sink, and avoiding thermal gradients. Additionally, calibrating the device and using a high-accuracy voltage reference can improve temperature measurement accuracy.
  • Although the datasheet specifies a maximum VCC voltage of 5.5V, it's recommended to keep the voltage below 5V to ensure reliable operation and prevent damage to the device. Exceeding the maximum voltage can lead to device failure or reduced lifespan.
  • The LC717A00AJ-AH is rated for operation up to 125°C, but its accuracy and reliability may degrade at higher temperatures. If you need to operate the device in a high-temperature environment, consider using a heat sink or thermal management system to keep the device temperature within the recommended range.
  • To troubleshoot issues with the LC717A00AJ-AH, start by verifying the device's power supply, clock signal, and communication protocol. Check for proper PCB layout, thermal design, and signal integrity. Use a logic analyzer or oscilloscope to debug the communication protocol and verify the device's output. Consult the datasheet and application notes for guidance on troubleshooting specific issues.

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