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LD2979M33TR - STMicroelectronics

Description: LD2979M33TR, Low Dropout Voltage Regulator, 0.05A, 3.3 V, 5-Pin SOT-23

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Symbol
LD2979M33TR - STMicroelectronics - PCB symbol
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PCB Footprints
LD2979M33TR - STMicroelectronics PCB footprint - SOT23 (5-Pin) - SOT23 (5-Pin) - SOT23-5L-ren1
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3D Models
LD2979M33TR - STMicroelectronics - 3D model - SOT23 (5-Pin) - SOT23-5L-ren1
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LD2979M33TR Details

  • Manufacturer Part Number:

    LD2979M33TR

  • Brand Name:

    STMicroelectronics

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    SOT-23

  • Package Description:

    ROHS COMPLIANT, SOT-23, 5 PIN

  • Pin Count:

    5

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Manufacturer:

    STMicroelectronics

  • YTEOL:

    0

  • Adjustability:

    FIXED

  • Dropout Voltage1-Max:

    0.6 V

  • Dropout Voltage1-Nom:

    0.2 V

  • Input Voltage Absolute-Max:

    16 V

  • Input Voltage-Max:

    16 V

  • Input Voltage-Min:

    4.3 V

  • JESD-30 Code:

    R-PDSO-G5

  • JESD-609 Code:

    e3

  • Length:

    2.9 mm

  • Line Regulation-Max:

    0.0247%

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Outputs:

    1

  • Number of Terminals:

    5

  • Operating Temperature TJ-Max:

    125 °C

  • Operating Temperature TJ-Min:

    -25 °C

  • Output Current1-Max:

    0.05 A

  • Output Voltage1-Max:

    3.432 V

  • Output Voltage1-Min:

    3.168 V

  • Output Voltage1-Nom:

    3.3 V

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    LSSOP

  • Package Equivalence Code:

    TSOP5/6,.11,37

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

  • Packing Method:

    TR

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Regulator Type:

    FIXED POSITIVE SINGLE OUTPUT LDO REGULATOR

  • Seated Height-Max:

    1.45 mm

  • Surface Mount:

    YES

  • Technology:

    BIPOLAR

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.95 mm

  • Terminal Position:

    DUAL

  • Voltage Tolerance-Max:

    4%

  • Width:

    1.625 mm

LD2979M33TR Frequently Asked Questions (FAQs)

  • A good PCB layout for optimal thermal performance involves placing the device near a thermal pad or a heat sink, and ensuring good thermal conductivity between the device and the PCB. A 2-layer or 4-layer PCB with a solid ground plane is recommended. Avoid placing thermal vias under the device, and keep the PCB traces away from the device's thermal pad.
  • To ensure the device's output voltage is stable and accurate, make sure to decouple the input and output pins with suitable capacitors, and use a stable input voltage source. Also, ensure the device is operated within its recommended operating conditions, and the output voltage is set correctly using the feedback resistors.
  • The recommended input capacitor value is 10uF to 22uF, and the type should be a low-ESR ceramic capacitor, such as X5R or X7R. This helps to filter out noise and ripple on the input voltage.
  • To protect the device from overcurrent and overheating, use a suitable current limiting resistor or a fuse in series with the input voltage, and ensure the device is operated within its recommended operating conditions. Also, use a thermal monitoring circuit to detect overheating and shut down the device if necessary.
  • The recommended output capacitor value is 10uF to 22uF, and the type should be a low-ESR ceramic capacitor, such as X5R or X7R. This helps to filter out noise and ripple on the output voltage.

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LD2979M33TR Overview

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About STMicroelectronics

STMicroelectronics (ST) is a global semiconductor company that designs, manufactures, and markets a broad range of integrated circuits (ICs), discrete devices, and other electronic components. STMicroelectronics offers a diverse portfolio of semiconductor products covering a wide range of applications and industries. Their product categories include microcontrollers, analog and mixed-signal ICs, MEMS (Micro-Electro-Mechanical Systems) sensors, power management ICs, RF (Radio Frequency) transceivers, aut

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