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LD39130SJ12R - STMicroelectronics

Description: 300 mA very low quiescent current linear regulator IC with the automatic green mode

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PCB Footprints
LD39130SJ12R - STMicroelectronics PCB footprint - BGA - BGA - Flip-chip 4_2022_1-3
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3D Models
LD39130SJ12R - STMicroelectronics  - 3D model - BGA - Flip-chip 4_2022_1-3
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LD39130SJ12R Details

  • Manufacturer Part Number:

    LD39130SJ12R

  • Brand Name:

    STMicroelectronics

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    FLIP CHIP-4

  • Country Of Origin:

    Italy

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Factory Lead Time:

    18 Weeks

  • Manufacturer:

    STMicroelectronics

  • YTEOL:

    6.21

  • Adjustability:

    FIXED

  • Dropout Voltage1-Nom:

    0.3 V

  • Input Voltage Absolute-Max:

    7 V

  • Input Voltage-Max:

    5.5 V

  • Input Voltage-Min:

    1.4 V

  • JESD-30 Code:

    S-PBGA-B4

  • Length:

    0.69 mm

  • Line Regulation-Max:

    0.0246%

  • Number of Functions:

    1

  • Number of Outputs:

    1

  • Number of Terminals:

    4

  • Operating Temperature TJ-Max:

    125 °C

  • Operating Temperature TJ-Min:

    -40 °C

  • Output Current1-Max:

    0.3 A

  • Output Voltage1-Max:

    1.23 V

  • Output Voltage1-Min:

    1.17 V

  • Output Voltage1-Nom:

    1.2 V

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    VFBGA

  • Package Equivalence Code:

    BGA4,2X2,16

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY, VERY THIN PROFILE, FINE PITCH

  • Packing Method:

    TR

  • Peak Reflow Temperature (Cel):

    260

  • Regulator Type:

    FIXED POSITIVE SINGLE OUTPUT STANDARD REGULATOR

  • Seated Height-Max:

    0.515 mm

  • Surface Mount:

    YES

  • Terminal Form:

    BALL

  • Terminal Pitch:

    0.4 mm

  • Terminal Position:

    BOTTOM

  • Voltage Tolerance-Max:

    2.5%

  • Width:

    0.69 mm

LD39130SJ12R Frequently Asked Questions (FAQs)

  • STMicroelectronics recommends a 2-layer or 4-layer PCB with a thermal pad connected to a large copper area on the bottom layer to dissipate heat efficiently.
  • Implement a thermal management strategy, such as heat sinks, thermal interfaces, or fans, to keep the junction temperature below 150°C. Also, ensure proper PCB design and component selection to minimize thermal resistance.
  • Use a pi-filter or a common-mode choke to reduce EMI emissions. Add capacitors and resistors to filter out high-frequency noise. Ensure proper PCB layout and grounding to minimize noise coupling.
  • Use the device's low-power modes, such as standby or shutdown, when not in use. Optimize the switching frequency and adjust the output voltage to minimize power losses. Implement power-saving features, like dynamic voltage scaling, if possible.
  • Use a high-precision multimeter to measure voltage, current, and power. Utilize an oscilloscope to analyze waveforms and switching behavior. Implement a test fixture with proper connections and load conditions to ensure accurate measurements.

Trust Checks

This model has been built in collaboration with the manufacturer.
Manufacturer Collaborated
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LD39130SJ12R Overview

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About STMicroelectronics

STMicroelectronics (ST) is a global semiconductor company that designs, manufactures, and markets a broad range of integrated circuits (ICs), discrete devices, and other electronic components. STMicroelectronics offers a diverse portfolio of semiconductor products covering a wide range of applications and industries. Their product categories include microcontrollers, analog and mixed-signal ICs, MEMS (Micro-Electro-Mechanical Systems) sensors, power management ICs, RF (Radio Frequency) transceivers, aut

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