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LD59015C30R - STMicroelectronics

Description: 150 mA low noise high PSRR linear voltage regulator

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PCB Footprints
LD59015C30R - STMicroelectronics PCB footprint - SOT23 (5-Pin) - SOT23 (5-Pin) - SOT323-5L_2022-1-2
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3D Models
LD59015C30R - STMicroelectronics  - 3D model - SOT23 (5-Pin) - SOT323-5L_2022-1-2
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LD59015C30R Details

  • Manufacturer Part Number:

    LD59015C30R

  • Brand Name:

    STMicroelectronics

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    SC-70

  • Package Description:

    SOT-323, 5 PIN

  • Pin Count:

    5

  • Manufacturer Package Code:

    SOT323

  • Country Of Origin:

    Malaysia

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Factory Lead Time:

    20 Weeks

  • Manufacturer:

    STMicroelectronics

  • YTEOL:

    0

  • Adjustability:

    FIXED

  • Dropout Voltage1-Max:

    0.21 V

  • Dropout Voltage1-Nom:

    0.15 V

  • Input Voltage Absolute-Max:

    7 V

  • Input Voltage-Max:

    5.5 V

  • Input Voltage-Min:

    2.4 V

  • JESD-30 Code:

    R-PDSO-G5

  • JESD-609 Code:

    e4

  • Length:

    2 mm

  • Load Regulation-Max(%):

    0.00447%

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Outputs:

    1

  • Number of Terminals:

    5

  • Operating Temperature TJ-Max:

    125 °C

  • Operating Temperature TJ-Min:

    -40 °C

  • Output Current1-Max:

    0.15 A

  • Output Voltage1-Max:

    3.054 V

  • Output Voltage1-Min:

    2.946 V

  • Output Voltage1-Nom:

    3 V

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSSOP

  • Package Equivalence Code:

    TSSOP5/6,.08

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

  • Packing Method:

    TR

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Regulator Type:

    FIXED POSITIVE SINGLE OUTPUT LDO REGULATOR

  • Seated Height-Max:

    1.1 mm

  • Surface Mount:

    YES

  • Technology:

    BICMOS

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Voltage Tolerance-Max:

    1.8%

  • Width:

    1.25 mm

LD59015C30R Frequently Asked Questions (FAQs)

  • STMicroelectronics recommends a PCB layout with a thermal pad connected to a large copper area on the bottom layer, and multiple vias to dissipate heat efficiently. A minimum of 2oz copper thickness is recommended.
  • To ensure reliable operation at high temperatures, it's essential to follow the recommended thermal design guidelines, use a suitable thermal interface material, and ensure good airflow around the device. Additionally, consider derating the device's power dissipation according to the temperature derating curve provided in the datasheet.
  • The maximum allowed voltage on the input pins is 6V, which is the absolute maximum rating. However, for reliable operation, it's recommended to keep the input voltage within the recommended operating range of 4.5V to 5.5V.
  • The LD59015C30R has built-in ESD protection, but it's still recommended to follow proper ESD handling procedures during assembly and testing. Use an ESD wrist strap or mat, and ensure that the device is stored in an ESD-protected package.
  • The recommended capacitor value for the output filter depends on the specific application and desired ripple voltage. A general guideline is to use a capacitor with a value between 10uF to 22uF, with a voltage rating of at least 6.3V.

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LD59015C30R Overview

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About STMicroelectronics

STMicroelectronics (ST) is a global semiconductor company that designs, manufactures, and markets a broad range of integrated circuits (ICs), discrete devices, and other electronic components. STMicroelectronics offers a diverse portfolio of semiconductor products covering a wide range of applications and industries. Their product categories include microcontrollers, analog and mixed-signal ICs, MEMS (Micro-Electro-Mechanical Systems) sensors, power management ICs, RF (Radio Frequency) transceivers, aut

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