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LDK130C10R - STMicroelectronics

Description: 300 mA low quiescent current very low noise LDO (automotive for SOT23-5L package)

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Symbol
LDK130C10R - STMicroelectronics - PCB symbol
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PCB Footprints
LDK130C10R - STMicroelectronics PCB footprint - SOT23 (5-Pin) - SOT23 (5-Pin) - LDK130C10R
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3D Models
LDK130C10R - STMicroelectronics - 3D model - SOT23 (5-Pin) - LDK130C10R
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LDK130C10R Details

  • Manufacturer Part Number:

    LDK130C10R

  • Brand Name:

    STMicroelectronics

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Country Of Origin:

    Malaysia

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Factory Lead Time:

    20 Weeks

  • Manufacturer:

    STMicroelectronics

  • YTEOL:

    8

  • Adjustability:

    FIXED

  • Dropout Voltage1-Nom:

    1 V

  • Input Voltage Absolute-Max:

    7 V

  • Input Voltage-Max:

    5.5 V

  • Input Voltage-Min:

    1.9 V

  • JESD-30 Code:

    R-PDSO-G5

  • JESD-609 Code:

    e4

  • Length:

    2 mm

  • Line Regulation-Max:

    0.0018%

  • Load Regulation-Max:

    0.01794%

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Outputs:

    1

  • Number of Terminals:

    5

  • Operating Temperature TJ-Max:

    125 °C

  • Operating Temperature TJ-Min:

    -40 °C

  • Output Current1-Max:

    0.3 A

  • Output Voltage1-Max:

    1.03 V

  • Output Voltage1-Min:

    0.97 V

  • Output Voltage1-Nom:

    1 V

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSSOP

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

  • Packing Method:

    TR

  • Peak Reflow Temperature (Cel):

    260

  • Regulator Type:

    FIXED POSITIVE SINGLE OUTPUT LDO REGULATOR

  • Seated Height-Max:

    1.1 mm

  • Surface Mount:

    YES

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Voltage Tolerance-Max:

    3%

  • Width:

    1.25 mm

LDK130C10R Frequently Asked Questions (FAQs)

  • STMicroelectronics recommends a 4-layer PCB with a solid ground plane and a separate power plane for the LDK130C10R. The device should be placed near the power source, and the input and output tracks should be kept short and wide to minimize inductance and resistance.
  • The LDK130C10R has a thermal pad on the bottom of the package, which should be connected to a thermal ground plane on the PCB. A thermal interface material (TIM) can be used to improve heat transfer between the device and the heat sink. The heat sink should be designed to keep the junction temperature below 125°C.
  • STMicroelectronics recommends using a ceramic capacitor with a value between 1uF and 10uF, and a voltage rating of at least 25V. The capacitor should be placed as close as possible to the input pins of the LDK130C10R to minimize inductance and noise.
  • To troubleshoot issues with the LDK130C10R, check the input voltage, output voltage, and current consumption using an oscilloscope and a multimeter. Verify that the device is properly soldered and that the PCB layout meets the recommended guidelines. Check for any signs of overheating, such as a high junction temperature or a malfunctioning thermal protection circuit.
  • Yes, the LDK130C10R is qualified for use in high-reliability and automotive applications. It meets the requirements of the AEC-Q100 standard for automotive-grade components, and it is also suitable for use in industrial and medical applications that require high reliability.

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LDK130C10R Overview

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About STMicroelectronics

STMicroelectronics (ST) is a global semiconductor company that designs, manufactures, and markets a broad range of integrated circuits (ICs), discrete devices, and other electronic components. STMicroelectronics offers a diverse portfolio of semiconductor products covering a wide range of applications and industries. Their product categories include microcontrollers, analog and mixed-signal ICs, MEMS (Micro-Electro-Mechanical Systems) sensors, power management ICs, RF (Radio Frequency) transceivers, aut

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