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LDK130M12R - STMicroelectronics

Description: STMicroelectronics LDK130M12R, LDO Voltage Regulator, 300mA, 1.2 V ±3%, 1.9 → 5.5 Vin, 5-Pin SOT-23

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Symbol
LDK130M12R - STMicroelectronics - PCB symbol
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PCB Footprints
LDK130M12R - STMicroelectronics PCB footprint - SOT23 (5-Pin) - SOT23 (5-Pin) - SOT23-5L_3
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3D Models
LDK130M12R - STMicroelectronics - 3D model - SOT23 (5-Pin) - SOT23-5L_3
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LDK130M12R Details

  • Manufacturer Part Number:

    LDK130M12R

  • Brand Name:

    STMicroelectronics

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Factory Lead Time:

    16 Weeks

  • Manufacturer:

    STMicroelectronics

  • YTEOL:

    8

  • Adjustability:

    FIXED

  • Dropout Voltage1-Nom:

    1 V

  • Input Voltage Absolute-Max:

    7 V

  • Input Voltage-Max:

    5.5 V

  • Input Voltage-Min:

    1.9 V

  • JESD-30 Code:

    R-PDSO-G5

  • JESD-609 Code:

    e4

  • Length:

    2.95 mm

  • Line Regulation-Max:

    0.00216%

  • Load Regulation-Max:

    0.021528%

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Outputs:

    1

  • Number of Terminals:

    5

  • Operating Temperature TJ-Max:

    125 °C

  • Operating Temperature TJ-Min:

    -40 °C

  • Output Current1-Max:

    0.3 A

  • Output Voltage1-Max:

    1.236 V

  • Output Voltage1-Min:

    1.164 V

  • Output Voltage1-Nom:

    1.2 V

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    LSSOP

  • Package Equivalence Code:

    TSOP5,.11,37

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

  • Packing Method:

    TR

  • Peak Reflow Temperature (Cel):

    260

  • Regulator Type:

    FIXED POSITIVE SINGLE OUTPUT LDO REGULATOR

  • Seated Height-Max:

    1.45 mm

  • Surface Mount:

    YES

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.95 mm

  • Terminal Position:

    DUAL

  • Voltage Tolerance-Max:

    3%

  • Width:

    1.6 mm

LDK130M12R Frequently Asked Questions (FAQs)

  • STMicroelectronics provides a recommended PCB layout in the application note AN5323, which includes guidelines for component placement, routing, and thermal management to ensure optimal performance and minimize electromagnetic interference (EMI).
  • The LDK130M12R has a thermal pad on the bottom of the package, which should be connected to a heat sink or a thermal interface material (TIM) to ensure proper heat dissipation. A thermal design guide is available in the application note AN5323, which provides guidelines for thermal management.
  • The recommended input capacitor value for the LDK130M12R is 10uF to 22uF, with a voltage rating of at least 25V. The capacitor should be placed as close as possible to the input pins of the device to minimize noise and ensure stable operation.
  • STMicroelectronics provides a troubleshooting guide in the application note AN5323, which includes a step-by-step procedure for identifying and resolving common issues with the LDK130M12R. Additionally, the device has built-in protection features such as overtemperature protection and undervoltage lockout, which can help prevent damage and facilitate troubleshooting.
  • Yes, the LDK130M12R is qualified for use in high-reliability and automotive applications. It meets the requirements of the AEC-Q100 standard for automotive grade devices, and is also suitable for use in industrial and medical applications that require high reliability and long-term stability.

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LDK130M12R Overview

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About STMicroelectronics

STMicroelectronics (ST) is a global semiconductor company that designs, manufactures, and markets a broad range of integrated circuits (ICs), discrete devices, and other electronic components. STMicroelectronics offers a diverse portfolio of semiconductor products covering a wide range of applications and industries. Their product categories include microcontrollers, analog and mixed-signal ICs, MEMS (Micro-Electro-Mechanical Systems) sensors, power management ICs, RF (Radio Frequency) transceivers, aut

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