Okaya recommends a 4-layer PCB with a solid ground plane and thermal vias to dissipate heat. A minimum of 2 oz copper thickness is recommended. Additionally, a thermal pad on the bottom of the device should be connected to a heat sink or a thermal management system.
To ensure reliability and longevity, Okaya recommends operating the LE223 within the specified temperature range (-40°C to 125°C). Additionally, a derating of 1.5°C/W is recommended for every 10°C above 85°C. Proper thermal management, such as heat sinks or fans, should also be implemented.
Okaya recommends a soldering temperature of 260°C (max) with a dwell time of 3 seconds (max) for hand soldering. For reflow soldering, a temperature profile with a peak temperature of 240°C (max) and a dwell time of 60 seconds (max) is recommended.
Okaya recommends checking the PCB layout and thermal management for any issues. Verify that the input voltage and current are within the specified range. Check for any signs of physical damage or contamination. If issues persist, contact Okaya's technical support for further assistance.
Yes, Okaya recommends following proper EMI/EMC design guidelines, such as using a shielded enclosure, minimizing loop areas, and using EMI filters or chokes. Additionally, the LE223 has built-in EMI filters, but external filtering may still be required depending on the application.
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