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LE25S161XATAG - onsemi

Description: LE25S161XATAG, Serial-SPI Flash Memory, 2048K x 8 bit 16Mbit, 1.65 → 1.95 V, 8-Pin, WLCSP

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LE25S161XATAG - onsemi PCB footprint - BGA - BGA - LE25S161XATAG--
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LE25S161XATAG - onsemi  - 3D model - BGA - LE25S161XATAG--
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LE25S161XATAG Details

  • Manufacturer Part Number:

    LE25S161XATAG

  • Brand Name:

    ON Semiconductor

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Package Description:

    WLCSP-8

  • Manufacturer Package Code:

    567LC

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.32.00.51

  • Manufacturer:

    onsemi

  • YTEOL:

    0

  • Clock Frequency-Max (fCLK):

    70 MHz

  • Data Retention Time-Min:

    20

  • Endurance:

    100000 Write/Erase Cycles

  • JESD-30 Code:

    R-PBGA-B8

  • JESD-609 Code:

    e1

  • Length:

    2.92 mm

  • Memory Density:

    16777216 bit

  • Memory IC Type:

    FLASH

  • Memory Width:

    8

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    8

  • Number of Words:

    2097152 words

  • Number of Words Code:

    2000000

  • Operating Mode:

    SYNCHRONOUS

  • Operating Temperature-Max:

    90 °C

  • Operating Temperature-Min:

    -40 °C

  • Organization:

    2MX8

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    VFBGA

  • Package Equivalence Code:

    BGA8,2X4,20

  • Package Shape:

    RECTANGULAR

  • Package Style:

    GRID ARRAY, VERY THIN PROFILE, FINE PITCH

  • Parallel/Serial:

    SERIAL

  • Peak Reflow Temperature (Cel):

    260

  • Seated Height-Max:

    0.5 mm

  • Serial Bus Type:

    SPI

  • Standby Current-Max:

    0.00005 A

  • Supply Current-Max:

    0.008 mA

  • Supply Voltage-Max (Vsup):

    1.95 V

  • Supply Voltage-Min (Vsup):

    1.65 V

  • Supply Voltage-Nom (Vsup):

    1.8 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    TIN SILVER COPPER

  • Terminal Form:

    BALL

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Type:

    NOR TYPE

  • Width:

    1.53 mm

  • Write Protection:

    HARDWARE/SOFTWARE

LE25S161XATAG Frequently Asked Questions (FAQs)

  • A 4-layer PCB with a solid ground plane and a separate power plane is recommended. Keep the signal traces short and away from noise sources. Use a decoupling capacitor (e.g., 0.1uF) close to the VCC pin.
  • Use a capacitor (e.g., 10uF) connected between VCC and VSS to filter out power supply noise. Ensure a stable power supply voltage and avoid power cycling during data retention.
  • The maximum operating frequency is 133MHz, but it can be overclocked up to 166MHz with careful PCB design and signal integrity considerations.
  • Power-up: Apply VCC before applying clock signals. Power-down: Remove clock signals before removing VCC. Ensure a monotonic power supply ramp-up and ramp-down to prevent latch-up.
  • Use a heat sink or thermal pad to dissipate heat. Ensure good airflow around the device. Avoid overheating, as it can affect reliability and data retention.

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