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LE25U20AQGTXG - onsemi

Description: Read / write operations enabled by single 2.5V power supply : 2.30 to 3.60V supply voltage range; Operating frequency : 30MHz; Temperature range : -40 to 85°C; Serial interface : SPI mode 0, mode 3 supported; Sector size : 4K bytes/small sector, 64K bytes/sector; Small sector erase, sector erase, chip erase functions; Page program function (256 bytes / page); Block protect function; Status functions : Ready/busy information, protect information; Highly reliable read/write Number of rewrite times : 100,000 t

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PCB Footprints
LE25U20AQGTXG - onsemi PCB footprint - Small Outline No-lead - Small Outline No-lead - WDFN8 2x3, 0.5P
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LE25U20AQGTXG - onsemi  - 3D model - Small Outline No-lead - WDFN8 2x3, 0.5P
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LE25U20AQGTXG Details

  • Manufacturer Part Number:

    LE25U20AQGTXG

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    WDFN-8

  • Package Description:

    2 X 3 MM, 0.50 MM PITCH, HALOGEN AND LEAD FREE, WDFN-8

  • Pin Count:

    8

  • Manufacturer Package Code:

    511BY

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.32.00.51

  • Factory Lead Time:

    26 Weeks

  • Manufacturer:

    onsemi

  • YTEOL:

    5

  • Clock Frequency-Max (fCLK):

    30 MHz

  • JESD-30 Code:

    R-PDSO-N8

  • Length:

    3 mm

  • Memory Density:

    2097152 bit

  • Memory IC Type:

    FLASH

  • Memory Width:

    8

  • Number of Functions:

    1

  • Number of Terminals:

    8

  • Number of Words:

    262144 words

  • Number of Words Code:

    256000

  • Operating Mode:

    SYNCHRONOUS

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Organization:

    256KX8

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HVSON

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

  • Parallel/Serial:

    SERIAL

  • Programming Voltage:

    2.7 V

  • Seated Height-Max:

    0.8 mm

  • Supply Voltage-Max (Vsup):

    3.6 V

  • Supply Voltage-Min (Vsup):

    2.3 V

  • Supply Voltage-Nom (Vsup):

    2.5 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    DUAL

  • Width:

    2 mm

LE25U20AQGTXG Frequently Asked Questions (FAQs)

  • A 2-layer or 4-layer PCB with a solid ground plane and thermal vias is recommended. The device should be placed near a thermal pad or heat sink to dissipate heat efficiently.
  • Ensure that the device is operated within the recommended voltage and current ratings, and that the PCB is designed to minimize thermal resistance. Also, consider using thermal management techniques such as heat sinks or thermal interfaces.
  • The critical timing parameters include the input rise and fall times, clock frequency, and setup and hold times. Refer to the datasheet for specific values and ensure that your design meets these requirements.
  • Use ESD protection devices such as TVS diodes or ESD arrays on the input and output pins. Also, ensure that the PCB is designed with ESD protection in mind, including the use of ESD-resistant materials and proper grounding.
  • Use a 0.1uF to 1uF decoupling capacitor with a voltage rating of 10V or higher, placed as close as possible to the device's power pins. Additional capacitors may be required depending on the specific application and PCB layout.

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