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LE25U40CMDTWG - onsemi

Description: Operating frequency : 40MHz; Temperature range : -40 to 85°C; Serial interface : SPI mode 0, mode 3 supported / Dual Output, Dual I/O supported; Sector size : 4K bytes/small sector, 64K bytes/sector; Small sector erase, sector erase, chip erase functions; Page program function (256 bytes / page); Block protect function; Highly reliable read/write Number of rewrite times : 100,000 times Small sector erase time : 40ms (typ), 150ms (max) Sector erase time : 80ms (typ), 250ms (max) Chip erase time : 250ms (typ)

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LE25U40CMDTWG - onsemi PCB footprint - Small Outline Packages - Small Outline Packages - SOIC8-CASE751BD-01
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LE25U40CMDTWG - onsemi  - 3D model - Small Outline Packages - SOIC8-CASE751BD-01
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LE25U40CMDTWG Details

  • Manufacturer Part Number:

    LE25U40CMDTWG

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    SOIC-8

  • Manufacturer Package Code:

    751BD

  • Country Of Origin:

    Philippines

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.32.00.51

  • Factory Lead Time:

    48 Weeks

  • Manufacturer:

    onsemi

  • YTEOL:

    0

  • Clock Frequency-Max (fCLK):

    40 MHz

  • Data Retention Time-Min:

    20

  • Endurance:

    100000 Write/Erase Cycles

  • JESD-30 Code:

    R-PDSO-G8

  • JESD-609 Code:

    e3

  • Length:

    4.9 mm

  • Memory Density:

    4194304 bit

  • Memory IC Type:

    FLASH

  • Memory Width:

    8

  • Moisture Sensitivity Level:

    2

  • Number of Functions:

    1

  • Number of Terminals:

    8

  • Number of Words:

    524288 words

  • Number of Words Code:

    512000

  • Operating Mode:

    SYNCHRONOUS

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Organization:

    512KX8

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Equivalence Code:

    SOP8,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Parallel/Serial:

    SERIAL

  • Peak Reflow Temperature (Cel):

    260

  • Programming Voltage:

    2.7 V

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.75 mm

  • Serial Bus Type:

    SPI

  • Standby Current-Max:

    0.00001 A

  • Supply Current-Max:

    0.015 mA

  • Supply Voltage-Max (Vsup):

    3.6 V

  • Supply Voltage-Min (Vsup):

    2.3 V

  • Supply Voltage-Nom (Vsup):

    2.5 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    MATTE TIN

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Type:

    NOR TYPE

  • Width:

    3.9 mm

  • Write Protection:

    HARDWARE/SOFTWARE

LE25U40CMDTWG Frequently Asked Questions (FAQs)

  • A 2-layer or 4-layer PCB with a solid ground plane and thermal vias is recommended. The device should be placed near a thermal pad or heat sink to dissipate heat efficiently.
  • Ensure proper heat sinking, use a thermal interface material, and follow the recommended PCB layout. Also, consider derating the device's power handling at high temperatures.
  • The SOA is typically defined by the device's voltage, current, and power ratings. For the LE25U40CMDTWG, the SOA is limited by the maximum voltage rating of 40V, maximum current rating of 25A, and maximum power rating of 100W.
  • Use a transient voltage suppressor (TVS) or a zener diode to clamp voltage transients. Also, ensure proper PCB layout and routing to minimize electromagnetic interference (EMI) and radio-frequency interference (RFI).
  • A gate drive circuit with a high-current, low-impedance output is recommended. A gate resistor value of 10-20 ohms is typical, and a gate-source voltage of 10-15V is recommended for optimal switching performance.

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LE25U40CMDTWG Overview

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Part Image LE25U40CMC onsemi

Flash, 512KX8, PDSO8