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LEOAC08PT-D - STMicroelectronics

Description: Rad-hard plastic Quad two-input AND gate

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LEOAC08PT-D - STMicroelectronics - PCB symbol
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PCB Footprints
LEOAC08PT-D - STMicroelectronics PCB footprint - Small Outline Packages - Small Outline Packages - TSSOP20
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LEOAC08PT-D - STMicroelectronics - 3D model - Small Outline Packages - TSSOP20
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LEOAC08PT-D Details

  • Manufacturer Part Number:

    LEOAC08PT-D

  • Brand Name:

    STMicroelectronics

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    TSSOP-8

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Factory Lead Time:

    20 Weeks

  • Manufacturer:

    STMicroelectronics

  • YTEOL:

    5

  • Family:

    AC

  • JESD-30 Code:

    R-PDSO-G20

  • Length:

    6.5 mm

  • Load Capacitance (CL):

    50 pF

  • Logic IC Type:

    AND GATE

  • Max I(ol):

    0.024 A

  • Number of Functions:

    4

  • Number of Inputs:

    2

  • Number of Terminals:

    20

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSSOP

  • Package Equivalence Code:

    TSSOP20,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

  • Packing Method:

    TR

  • Prop. Delay@Nom-Sup:

    12.5 ns

  • Propagation Delay (tpd):

    12.5 ns

  • Schmitt Trigger:

    NO

  • Screening Level:

    AEC-Q100

  • Seated Height-Max:

    1.2 mm

  • Supply Voltage-Max (Vsup):

    6 V

  • Supply Voltage-Min (Vsup):

    2 V

  • Supply Voltage-Nom (Vsup):

    5 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Total Dose:

    50k Rad(Si) V

  • Width:

    4.4 mm

LEOAC08PT-D Frequently Asked Questions (FAQs)

  • STMicroelectronics recommends a thermal pad on the bottom of the package, connected to a large copper area on the PCB to dissipate heat efficiently. A minimum of 2oz copper thickness is recommended.
  • To ensure reliable operation in high-temperature environments, it is essential to follow the recommended thermal design guidelines, use a suitable heat sink, and ensure good airflow around the device. Additionally, consider using a thermistor or thermal sensor to monitor the temperature and implement thermal protection mechanisms if necessary.
  • STMicroelectronics recommends a peak reflow temperature of 260°C, with a soldering time of 10-30 seconds. The recommended soldering profile is available in the STMicroelectronics soldering guide.
  • To prevent ESD damage, handle the device by the body or pins, avoid touching the pins, and use an ESD wrist strap or mat during assembly. Ensure that the PCB and assembly equipment are also ESD-protected.
  • Store the device in a dry, cool place, away from direct sunlight and moisture. The recommended storage temperature range is -40°C to 125°C, and the recommended humidity range is 20% to 80% RH.

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LEOAC08PT-D Overview

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About STMicroelectronics

STMicroelectronics (ST) is a global semiconductor company that designs, manufactures, and markets a broad range of integrated circuits (ICs), discrete devices, and other electronic components. STMicroelectronics offers a diverse portfolio of semiconductor products covering a wide range of applications and industries. Their product categories include microcontrollers, analog and mixed-signal ICs, MEMS (Micro-Electro-Mechanical Systems) sensors, power management ICs, RF (Radio Frequency) transceivers, aut

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