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LESR50-NP - LEM

Description: Current Sensor 50A 1 Channel Hall Effect, Closed Loop Bidirectional Module

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LESR50-NP - LEM PCB footprint - Other - Other - LESR50-NP-1
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LESR50-NP - LEM  - 3D model - Other - LESR50-NP-1
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LESR50-NP Details

  • Manufacturer Part Number:

    LESR50-NP

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • ECCN Code:

    EAR99

  • Manufacturer:

    LEM Holdings SSA

  • Body Breadth:

    13.4 mm

  • Body Height:

    20.3 mm

  • Body Length or Diameter:

    21.91 mm

  • Mounting Feature:

    BOARD MOUNT

  • Number of Terminals:

    14

  • Operating Temperature-Max:

    105 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Range:

    0.25-4.75V

  • Output Type:

    OUTPUT VOLTAGE

  • Package Shape/Style:

    RECTANGULAR

  • Sensors/Transducers Type:

    CURRENT SENSOR

  • Supply Voltage-Max:

    5.25 V

  • Supply Voltage-Min:

    4.75 V

  • Surface Mount:

    NO

LESR50-NP Frequently Asked Questions (FAQs)

  • The recommended PCB layout for the LESR50-NP involves keeping the current path as short as possible, using a solid ground plane, and placing the device close to the current-carrying conductor to minimize stray inductance.
  • The LESR50-NP is designed to withstand overcurrent conditions up to 10 times the nominal current rating for a short duration. However, it's essential to implement external overcurrent protection to prevent damage to the device and ensure safe operation.
  • The thermal derating curve for the LESR50-NP is not explicitly provided in the datasheet. However, as a general guideline, the device's current rating should be derated by 1.5% per degree Celsius above 25°C to ensure reliable operation.
  • While the LESR50-NP is primarily designed for DC current sensing, it can be used in high-frequency applications up to 100 kHz. However, the device's accuracy and bandwidth may be affected, and additional filtering or signal conditioning may be required.
  • The LESR50-NP is rated for operation up to 85°C, but it's essential to consider the device's thermal characteristics and ensure proper heat sinking to prevent overheating. For high-temperature applications above 85°C, consult with LEM Holdings SSA or consider alternative devices.

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