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LF33ABDT-TR - STMicroelectronics

Description: LF33ABDT-TR, Low Dropout Voltage Regulator, 0.5A, 3.3 V ±1%, 3-Pin DPAK

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PCB Footprints
LF33ABDT-TR - STMicroelectronics PCB footprint - Other - Other - DPAK_06
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LF33ABDT-TR - STMicroelectronics  - 3D model - Other - DPAK_06
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LF33ABDT-TR Details

  • Manufacturer Part Number:

    LF33ABDT-TR

  • Brand Name:

    STMicroelectronics

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    TO-252

  • Package Description:

    DPAK-3/2

  • Pin Count:

    3

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Factory Lead Time:

    12 Weeks

  • Manufacturer:

    STMicroelectronics

  • YTEOL:

    6.2

  • Adjustability:

    FIXED

  • Dropout Voltage1-Max:

    0.7 V

  • Dropout Voltage1-Nom:

    0.4 V

  • Input Voltage Absolute-Max:

    40 V

  • Input Voltage-Max:

    16 V

  • Input Voltage-Min:

    4.3 V

  • JESD-30 Code:

    R-PSSO-G2

  • JESD-609 Code:

    e3

  • Length:

    6.5 mm

  • Line Regulation-Max:

    0.016%

  • Load Regulation-Max:

    0.016%

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Outputs:

    1

  • Number of Terminals:

    2

  • Operating Temperature TJ-Max:

    125 °C

  • Operating Temperature TJ-Min:

    -40 °C

  • Output Current1-Max:

    0.5 A

  • Output Voltage1-Max:

    3.366 V

  • Output Voltage1-Min:

    3.234 V

  • Output Voltage1-Nom:

    3.3 V

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TO-252

  • Package Equivalence Code:

    SMSIP3H,.38,90TB

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, HEAT SINK/SLUG

  • Packing Method:

    TR, 13 INCH

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Regulator Type:

    FIXED POSITIVE SINGLE OUTPUT LDO REGULATOR

  • Seated Height-Max:

    2.4 mm

  • Surface Mount:

    YES

  • Technology:

    BIPOLAR

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    2.28 mm

  • Terminal Position:

    SINGLE

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Voltage Tolerance-Max:

    1%

  • Width:

    6.1 mm

LF33ABDT-TR Frequently Asked Questions (FAQs)

  • A good PCB layout for the LF33ABDT-TR involves keeping the input and output capacitors close to the device, using a solid ground plane, and minimizing the length of the input and output traces. A 4-layer PCB with a dedicated power plane and a solid ground plane is recommended.
  • To ensure stability, it's essential to follow the recommended PCB layout, use a sufficient output capacitor (at least 10uF), and add a 1-2nF capacitor between the output and the feedback pin. Additionally, ensure that the input voltage is within the recommended range, and the output current is within the specified limits.
  • The maximum allowed input voltage ripple for the LF33ABDT-TR is 10% of the input voltage. Exceeding this limit may affect the device's performance and stability.
  • The LF33ABDT-TR is rated for operation up to 125°C. However, the device's performance and reliability may degrade at high temperatures. It's essential to ensure proper heat dissipation and consider the device's thermal characteristics when designing for high-temperature applications.
  • The output voltage tolerance can be calculated by considering the device's output voltage accuracy (±2% for the LF33ABDT-TR) and the tolerance of the external resistors used to set the output voltage. A total tolerance of ±4% is a reasonable estimate.

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LF33ABDT-TR Overview

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About STMicroelectronics

STMicroelectronics (ST) is a global semiconductor company that designs, manufactures, and markets a broad range of integrated circuits (ICs), discrete devices, and other electronic components. STMicroelectronics offers a diverse portfolio of semiconductor products covering a wide range of applications and industries. Their product categories include microcontrollers, analog and mixed-signal ICs, MEMS (Micro-Electro-Mechanical Systems) sensors, power management ICs, RF (Radio Frequency) transceivers, aut

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