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LH75411N0Q100C0 - NXP

Description: MCU, 32BIT, ARM7, 84MHZ, LQFP-144

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PCB Footprints
LH75411N0Q100C0 - NXP PCB footprint - Quad Flat Packages - Quad Flat Packages - SOT486-1
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3D Models
LH75411N0Q100C0 - NXP  - 3D model - Quad Flat Packages - SOT486-1
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LH75411N0Q100C0 Details

  • Manufacturer Part Number:

    LH75411N0Q100C0

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    QFP

  • Package Description:

    LQFP-144

  • Pin Count:

    144

  • HTS Code:

    8542.31.00.30

  • Manufacturer:

    NXP Semiconductors

  • YTEOL:

    0

  • Additional Feature:

    ALSO REQUIRES 3.3 V SUPPLY

  • Address Bus Width:

    24

  • Boundary Scan:

    YES

  • Bus Compatibility:

    CAN, SSP, UART(3)

  • Clock Frequency-Max:

    20 MHz

  • External Data Bus Width:

    16

  • JESD-30 Code:

    S-PQFP-G144

  • JESD-609 Code:

    e3

  • Length:

    20 mm

  • Moisture Sensitivity Level:

    3

  • Number of I/O Lines:

    76

  • Number of Serial I/Os:

    5

  • Number of Terminals:

    144

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    LFQFP

  • Package Equivalence Code:

    QFP144,.87SQ,20

  • Package Shape:

    SQUARE

  • Package Style:

    FLATPACK, LOW PROFILE, FINE PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • RAM (words):

    32768

  • Seated Height-Max:

    1.6 mm

  • Supply Current-Max:

    70 mA

  • Supply Voltage-Max:

    1.98 V

  • Supply Voltage-Min:

    1.7 V

  • Supply Voltage-Nom:

    1.8 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Terminal Finish:

    Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    QUAD

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    20 mm

  • uPs/uCs/Peripheral ICs Type:

    SoC

LH75411N0Q100C0 Frequently Asked Questions (FAQs)

  • A 2-layer or 4-layer PCB with a solid ground plane and thermal vias is recommended. Ensure a minimum of 1 oz copper thickness and a thermal relief pattern around the device.
  • Implement a robust thermal management system, including a heat sink and thermal interface material. Ensure proper PCB design, component selection, and soldering to prevent thermal stress.
  • Monitor the device's junction temperature, output voltage, and current. Implement over-temperature protection, over-voltage protection, and short-circuit protection to ensure reliable operation.
  • Use a low-dropout linear regulator (LDO) or a switching regulator with a low quiescent current. Optimize the PCB layout for minimal power loss and use low-ESR capacitors to reduce energy losses.
  • Implement ESD protection diodes (e.g., TVS diodes) on the input and output pins. Use a PCB layout with a solid ground plane and a Faraday cage structure to minimize ESD susceptibility.

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LH75411N0Q100C0 Overview

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About NXP

NXP Semiconductors is a leading manufacturer of semiconductor devices with a wide range of semiconductor solutions, including microcontrollers, sensors, connectivity solutions, power management ICs, and security solutions. These products are used in a variety of applications such as automotive, industrial automation, smart homes, mobile devices, and more. NXP Semiconductors is one of the world’s largest semiconductor companies and is headquartered in Eindhoven, the Netherlands.

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LH75411N0Q100C0SOT486-1