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LM324ADR2G - onsemi

Description: Common Mode Range Extends to Negative Supply; ESD Clamps on the Inputs Increase Ruggedness without Affecting Device Operation; True Differential Input Stage; Single Supply Operation: 3.0 V to 32 V (LM224, LM324, LM324A); Low Input Bias Currents: 100 nA Maximum (LM324A); Short Circuited Protected Outputs; Four Amplifiers Per Package; Industry Standard Pinouts; Internally Compensated; Pb-Free Packages are Available*

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LM324ADR2G - onsemi PCB footprint - Small Outline Packages - Small Outline Packages - SOIC-14 NB CASE751A-03 ISSUE L
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LM324ADR2G - onsemi  - 3D model - Small Outline Packages - SOIC-14 NB CASE751A-03 ISSUE L
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LM324ADR2G Details

  • Manufacturer Part Number:

    LM324ADR2G

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOIC-14 NB

  • Pin Count:

    14

  • Manufacturer Package Code:

    751A-03

  • Country Of Origin:

    Philippines

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.33.00.01

  • Factory Lead Time:

    8 Weeks

  • Manufacturer:

    onsemi

  • YTEOL:

    5.75

  • Amplifier Type:

    OPERATIONAL AMPLIFIER

  • Architecture:

    VOLTAGE-FEEDBACK

  • Average Bias Current-Max (IIB):

    0.2 µA

  • Bias Current-Max (IIB) @25C:

    0.1 µA

  • Common-mode Reject Ratio-Nom:

    70 dB

  • Frequency Compensation:

    YES

  • Input Offset Voltage-Max:

    3000 µV

  • JESD-30 Code:

    R-PDSO-G14

  • JESD-609 Code:

    e3

  • Length:

    8.65 mm

  • Low-Offset:

    NO

  • Micropower:

    YES

  • Moisture Sensitivity Level:

    1

  • Neg Supply Voltage Limit-Max:

    -16 V

  • Number of Functions:

    4

  • Number of Terminals:

    14

  • Operating Temperature-Max:

    70 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Equivalence Code:

    SOP14,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Packing Method:

    TAPE AND REEL

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.75 mm

  • Slew Rate-Nom:

    0.6 V/us

  • Supply Current-Max:

    3 mA

  • Supply Voltage Limit-Max:

    16 V

  • Supply Voltage-Nom (Vsup):

    5 V

  • Surface Mount:

    YES

  • Technology:

    BIPOLAR

  • Temperature Grade:

    COMMERCIAL

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Unity Gain BW-Nom:

    1000

  • Voltage Gain-Min:

    15000

  • Width:

    3.9 mm

LM324ADR2G Frequently Asked Questions (FAQs)

  • The maximum power dissipation of the LM324ADR2G is 670mW, which is calculated based on the package thermal resistance and the maximum junction temperature.
  • The LM324ADR2G is rated for operation up to 125°C, but the maximum junction temperature is 150°C. However, the device's performance may degrade at high temperatures, and the user should ensure that the device is properly heat-sinked and operated within the recommended operating conditions.
  • To ensure stability, the LM324ADR2G requires a minimum gain of 10 in the feedback loop, and the user should ensure that the feedback network is properly designed to prevent oscillations. Additionally, the user should follow proper PCB layout and grounding techniques to minimize noise and parasitic effects.
  • While the LM324ADR2G can be used as a comparator, it is not recommended due to its relatively slow slew rate and limited bandwidth. A dedicated comparator IC would be a better choice for most applications.
  • The LM324ADR2G has built-in ESD protection, but it is still recommended to follow proper handling and storage procedures to prevent ESD damage. Additionally, the user should ensure that the device is properly grounded and that the PCB is designed with ESD protection in mind.

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