LM75BDP,118 - NXP

LM75BDP,118 Details

• Manufacturer Part Number:

  LM75BDP,118

• Brand Name:

  NXP Semiconductor

• Rohs Code:

  Yes

• Part Life Cycle Code:

  Active

• Part Package Code:

  TSSOP

• Package Description:

  3 MM, PLASTIC, TSSOP-8

• Pin Count:

  8

• Manufacturer Package Code:

  SOT505-1

• Country Of Origin:

  Mainland China, Thailand

• ECCN Code:

  EAR99

• HTS Code:

  8542.39.00.01

• Factory Lead Time:

  16 Weeks

• Manufacturer:

  NXP Semiconductors

• YTEOL:

  7.9

• Accuracy-Max (Cel):

  3 Cel

• Body Breadth:

  3 mm

• Body Height:

  1.1 mm

• Body Length or Diameter:

  3 mm

• Housing:

  PLASTIC

• JESD-609 Code:

  e4

• Mounting Feature:

  SURFACE MOUNT

• Number of Bits:

  11

• Number of Terminals:

  8

• Operating Current-Max:

  0.3 mA

• Operating Temperature-Max:

  125 °C

• Operating Temperature-Min:

  -55 °C

• Output Interface Type:

  2-WIRE INTERFACE

• Package Body Material:

  PLASTIC/EPOXY

• Package Equivalence Code:

  TSSOP8,.19

• Package Shape/Style:

  SQUARE

• Sensors/Transducers Type:

  TEMPERATURE SENSOR,SWITCH/DIGITAL OUTPUT,SERIAL

• Supply Voltage-Max:

  5.5 V

• Supply Voltage-Min:

  2.8 V

• Surface Mount:

  YES

• Terminal Finish:

  Nickel/Palladium/Gold (Ni/Pd/Au)

• Termination Type:

  SOLDER