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LMR932F-GE2 - ROHM Semiconductor

Description: LMR™ Series, Low Power Input-Output Full Swing Operational Amplifier

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LMR932F-GE2 - ROHM Semiconductor  - 3D model
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LMR932F-GE2 Details

  • Manufacturer Part Number:

    LMR932F-GE2

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    SOP-8

  • Country Of Origin:

    Philippines

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.33.00.01

  • Manufacturer:

    ROHM Semiconductor

  • YTEOL:

    7.1

  • Amplifier Type:

    OPERATIONAL AMPLIFIER

  • Architecture:

    VOLTAGE-FEEDBACK

  • Average Bias Current-Max (IIB):

    0.035 µA

  • Bias Current-Max (IIB) @25C:

    0.035 µA

  • Common-mode Reject Ratio-Min:

    60 dB

  • Common-mode Reject Ratio-Nom:

    94 dB

  • Frequency Compensation:

    YES

  • Input Offset Voltage-Max:

    7500 µV

  • JESD-30 Code:

    R-PDSO-G8

  • Length:

    5 mm

  • Low-Bias:

    NO

  • Low-Offset:

    NO

  • Micropower:

    YES

  • Number of Functions:

    2

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Equivalence Code:

    SOP8,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Packing Method:

    TR

  • Peak Reflow Temperature (Cel):

    NOT SPECIFIED

  • Power:

    NO

  • Programmable Power:

    NO

  • Seated Height-Max:

    1.71 mm

  • Slew Rate-Nom:

    0.4 V/us

  • Supply Current-Max:

    0.42 mA

  • Supply Voltage Limit-Max:

    7 V

  • Supply Voltage-Nom (Vsup):

    2.7 V

  • Surface Mount:

    YES

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    NOT SPECIFIED

  • Unity Gain BW-Nom:

    1400

  • Voltage Gain-Min:

    39810.71706

  • Wideband:

    NO

  • Width:

    4.4 mm

LMR932F-GE2 Frequently Asked Questions (FAQs)

  • ROHM recommends a compact PCB layout with short traces and minimal vias to reduce parasitic inductance and capacitance. A 4-layer PCB with a solid ground plane is recommended. Additionally, place the input and output capacitors close to the IC and use a thermal relief pattern for the GND pin.
  • To ensure stability, follow the recommended component values and PCB layout. Additionally, ensure that the input and output capacitors are of high quality and have low ESR. Also, consider adding a small resistor (e.g., 10Ω) in series with the output capacitor to prevent oscillation.
  • While the datasheet specifies an operating temperature range of -40°C to 125°C, ROHM recommends derating the device for reliable operation above 85°C. For ambient temperatures above 85°C, reduce the output current and voltage to prevent overheating and ensure reliable operation.
  • Yes, the LMR932F-GE2 is designed to withstand vibrations up to 10G. However, ensure that the PCB is properly secured and the components are properly soldered to prevent mechanical stress and vibration-induced failures.
  • Start by verifying the input voltage, output voltage, and current. Check for proper PCB layout, component values, and soldering. Use an oscilloscope to check for oscillations or noise on the output. If issues persist, consult the ROHM application notes and contact ROHM support for further assistance.

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LMR932F-GE2 Overview

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