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LMV821ICT - STMicroelectronics

Description: Low power (440uA), general purpose BiPolar 5V Op-Amp, GBP=5.5MHz, single

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PCB Footprints
LMV821ICT - STMicroelectronics PCB footprint - SOT23 (5-Pin) - SOT23 (5-Pin) - SC70-5 (SOT323-5)
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3D Models
LMV821ICT - STMicroelectronics  - 3D model - SOT23 (5-Pin) - SC70-5 (SOT323-5)
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LMV821ICT Details

  • Manufacturer Part Number:

    LMV821ICT

  • Brand Name:

    STMicroelectronics

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOIC

  • Package Description:

    ROHS COMPLIANT, SC-70, 5 PIN

  • Pin Count:

    5

  • Country Of Origin:

    Malaysia

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.33.00.01

  • Factory Lead Time:

    16 Weeks

  • Manufacturer:

    STMicroelectronics

  • YTEOL:

    7.17

  • Amplifier Type:

    OPERATIONAL AMPLIFIER

  • Architecture:

    VOLTAGE-FEEDBACK

  • Average Bias Current-Max (IIB):

    0.18 µA

  • Bias Current-Max (IIB) @25C:

    12 µA

  • Common-mode Reject Ratio-Min:

    70 dB

  • Common-mode Reject Ratio-Nom:

    75 dB

  • Frequency Compensation:

    YES

  • Input Offset Voltage-Max:

    4000 µV

  • JESD-30 Code:

    R-PDSO-G5

  • JESD-609 Code:

    e4

  • Length:

    2 mm

  • Low-Bias:

    NO

  • Low-Offset:

    NO

  • Micropower:

    YES

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    5

  • Number of Terminals:

    1

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSSOP

  • Package Equivalence Code:

    TSSOP5/6,.08

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

  • Packing Method:

    TR

  • Peak Reflow Temperature (Cel):

    260

  • Power:

    NO

  • Programmable Power:

    NO

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.1 mm

  • Slew Rate-Min:

    1.2 V/us

  • Slew Rate-Nom:

    1.7 V/us

  • Supply Current-Max:

    0.6 mA

  • Supply Voltage Limit-Max:

    6 V

  • Supply Voltage-Nom (Vsup):

    2.7 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Unity Gain BW-Nom:

    5500

  • Voltage Gain-Min:

    17780

  • Wideband:

    NO

  • Width:

    1.25 mm

LMV821ICT Frequently Asked Questions (FAQs)

  • The recommended operating voltage range for the LMV821ICT is 2.7V to 5.5V, although it can operate down to 2.5V with reduced performance.
  • To ensure stability, make sure to decouple the power supply pins (VCC and GND) with a 10uF capacitor, and use a 1uF capacitor between the output pin and the inverting input pin (VIN-). Also, keep the layout clean and avoid long traces.
  • The maximum input voltage that the LMV821ICT can handle is 5.5V, which is the same as the maximum supply voltage. Exceeding this voltage may damage the device.
  • Yes, the LMV821ICT can be used as a comparator, but it's not recommended due to its op-amp architecture. The device is optimized for amplification and filtering, not for high-speed comparison. For comparator applications, consider using a dedicated comparator IC.
  • The gain-bandwidth product of the LMV821ICT is typically around 1.5MHz. To calculate it, multiply the gain (in dB) by the bandwidth (in Hz) at that gain. For example, at a gain of 20dB (10x), the bandwidth would be around 150kHz.

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LMV821ICT Overview

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About STMicroelectronics

STMicroelectronics (ST) is a global semiconductor company that designs, manufactures, and markets a broad range of integrated circuits (ICs), discrete devices, and other electronic components. STMicroelectronics offers a diverse portfolio of semiconductor products covering a wide range of applications and industries. Their product categories include microcontrollers, analog and mixed-signal ICs, MEMS (Micro-Electro-Mechanical Systems) sensors, power management ICs, RF (Radio Frequency) transceivers, aut

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