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LPC11E37FBD64/501E - NXP

Description: ARM Microcontrollers - MCU Scalable Entry Level 32-bit Microcontroller (MCU) based on ARM Cortex-M0+/M0 Cores

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LPC11E37FBD64/501E - NXP PCB footprint - Quad Flat Packages - Quad Flat Packages - SOT314-2
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LPC11E37FBD64/501E - NXP  - 3D model - Quad Flat Packages - SOT314-2
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LPC11E37FBD64/501E Details

  • Manufacturer Part Number:

    LPC11E37FBD64/501E

  • Brand Name:

    NXP Semiconductor

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    QFP

  • Pin Count:

    64

  • Manufacturer Package Code:

    SOT314-2

  • Country Of Origin:

    Taiwan

  • ECCN Code:

    3A991.A.2

  • HTS Code:

    8542.31.00.25

  • Factory Lead Time:

    13 Weeks

  • Manufacturer:

    NXP Semiconductors

  • YTEOL:

    5

  • Has ADC:

    YES

  • Bit Size:

    32

  • Boundary Scan:

    YES

  • CPU Family:

    CORTEX-M0

  • Clock Frequency-Max:

    25 MHz

  • DAC Channels:

    NO

  • DMA Channels:

    NO

  • JESD-30 Code:

    S-PQFP-G64

  • JESD-609 Code:

    e3

  • Length:

    10 mm

  • Moisture Sensitivity Level:

    2

  • Number of I/O Lines:

    54

  • Number of Terminals:

    64

  • On Chip Program ROM Width:

    8

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • PWM Channels:

    NO

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    QFP

  • Package Equivalence Code:

    QFP64,.47SQ,20

  • Package Shape:

    SQUARE

  • Package Style:

    FLATPACK

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • RAM (bytes):

    12288

  • ROM (words):

    131072

  • ROM Programmability:

    FLASH

  • Seated Height-Max:

    1.6 mm

  • Speed:

    50 MHz

  • Supply Voltage-Max:

    3.6 V

  • Supply Voltage-Min:

    1.8 V

  • Supply Voltage-Nom:

    3.3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    QUAD

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    10 mm

  • uPs/uCs/Peripheral ICs Type:

    MICROCONTROLLER, RISC

LPC11E37FBD64/501E Frequently Asked Questions (FAQs)

  • The maximum operating temperature range for the LPC11E37FBD64/501E is -40°C to +85°C.
  • The clock settings for the LPC11E37FBD64/501E can be configured using the Clock Generation Unit (CGU) registers. The CGU provides a flexible clock generation system that allows the user to select the clock source, divider, and multiplier to generate the desired clock frequency.
  • The maximum current consumption of the LPC11E37FBD64/501E is approximately 45 mA at 48 MHz with all peripherals enabled and running at maximum frequency.
  • The ADC on the LPC11E37FBD64/501E is a 10-bit successive approximation ADC with a maximum sampling rate of 400 kHz. To use the ADC, the user must configure the ADC clock, select the ADC channel, and start the ADC conversion. The ADC result can be read from the ADC register.
  • Yes, the LPC11E37FBD64/501E can be used with an external crystal oscillator. The microcontroller has an internal oscillator that can be used as the clock source, but an external crystal oscillator can be used for more accurate clock generation.

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LPC11E37FBD64/501E Overview

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About NXP

NXP Semiconductors is a leading manufacturer of semiconductor devices with a wide range of semiconductor solutions, including microcontrollers, sensors, connectivity solutions, power management ICs, and security solutions. These products are used in a variety of applications such as automotive, industrial automation, smart homes, mobile devices, and more. NXP Semiconductors is one of the world’s largest semiconductor companies and is headquartered in Eindhoven, the Netherlands.

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