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LPC1756FBD80 - NXP

Description: ARM® Cortex®-M3 LPC17xx Microcontroller IC 32-Bit Single-Core 100MHz 256KB (256K x 8) FLASH 80-LQFP (12x12)

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PCB Footprints
LPC1756FBD80 - NXP PCB footprint - Quad Flat Packages - Quad Flat Packages - SOT315-1
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LPC1756FBD80 - NXP  - 3D model - Quad Flat Packages - SOT315-1
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LPC1756FBD80 Details

  • Manufacturer Part Number:

    LPC1756FBD80

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    QFP

  • Pin Count:

    80

  • Country Of Origin:

    Taiwan

  • ECCN Code:

    3A991.A.2

  • HTS Code:

    8542.31.00.25

  • Manufacturer:

    NXP Semiconductors

  • YTEOL:

    5

  • Has ADC:

    YES

  • Bit Size:

    32

  • Boundary Scan:

    YES

  • Clock Frequency-Max:

    12 MHz

  • DAC Channels:

    YES

  • DMA Channels:

    YES

  • JESD-30 Code:

    S-PQFP-G80

  • JESD-609 Code:

    e3

  • Length:

    12 mm

  • Moisture Sensitivity Level:

    2

  • Number of I/O Lines:

    52

  • Number of Terminals:

    80

  • On Chip Program ROM Width:

    8

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • PWM Channels:

    YES

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    LFQFP

  • Package Equivalence Code:

    QFP80,.55SQ,20

  • Package Shape:

    SQUARE

  • Package Style:

    FLATPACK, LOW PROFILE, FINE PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • RAM (bytes):

    32768

  • ROM (words):

    262144

  • ROM Programmability:

    FLASH

  • Seated Height-Max:

    1.6 mm

  • Speed:

    100 MHz

  • Supply Current-Max:

    100 mA

  • Supply Voltage-Max:

    3.6 V

  • Supply Voltage-Min:

    3.3 V

  • Supply Voltage-Nom:

    3.3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    QUAD

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    12 mm

  • uPs/uCs/Peripheral ICs Type:

    MICROCONTROLLER, RISC

LPC1756FBD80 Frequently Asked Questions (FAQs)

  • The maximum clock frequency for the LPC1756FBD80 is 100 MHz, but it can be overclocked to 120 MHz with some limitations.
  • The pin multiplexing on the LPC1756FBD80 can be configured using the PINSEL registers, which allow you to select the function of each pin. The specific configuration will depend on the application and the peripherals being used.
  • The maximum amount of current that can be sourced or sunk by the GPIO pins on the LPC1756FBD80 is 4 mA per pin, with a total current limit of 100 mA per bank.
  • The ADC on the LPC1756FBD80 can be used by configuring the ADC registers, selecting the input channel, and starting the conversion. The ADC can operate in various modes, including single-shot, continuous, and burst modes.
  • The boot loader on the LPC1756FBD80 is used to load the application code into the microcontroller's flash memory. It can be used to update the firmware in the field or to load a new application.

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LPC1756FBD80 Overview

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About NXP

NXP Semiconductors is a leading manufacturer of semiconductor devices with a wide range of semiconductor solutions, including microcontrollers, sensors, connectivity solutions, power management ICs, and security solutions. These products are used in a variety of applications such as automotive, industrial automation, smart homes, mobile devices, and more. NXP Semiconductors is one of the world’s largest semiconductor companies and is headquartered in Eindhoven, the Netherlands.

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