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LPC1768FET100 - NXP

Description: RISC MICROCONTROLLER, 32-BIT, FLASH, 100MHZ, CMOS, PBGA100

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Symbol
LPC1768FET100 - NXP - PCB symbol
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PCB Footprints
LPC1768FET100 - NXP PCB footprint - BGA - BGA - SOT926-1 (TFBGA100)
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3D Models
LPC1768FET100 - NXP - 3D model - BGA - SOT926-1 (TFBGA100)
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LPC1768FET100 Details

  • Manufacturer Part Number:

    LPC1768FET100

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    BGA

  • Package Description:

    TFBGA-100

  • Pin Count:

    100

  • Manufacturer Package Code:

    SOT-926-1

  • Country Of Origin:

    Taiwan

  • ECCN Code:

    3A991.A.2

  • HTS Code:

    8542.31.00.25

  • Manufacturer:

    NXP Semiconductors

  • YTEOL:

    5

  • Has ADC:

    YES

  • Bit Size:

    32

  • Clock Frequency-Max:

    25 MHz

  • DAC Channels:

    YES

  • DMA Channels:

    YES

  • JESD-30 Code:

    S-PBGA-B100

  • JESD-609 Code:

    e2

  • Length:

    9 mm

  • Moisture Sensitivity Level:

    3

  • Number of I/O Lines:

    70

  • Number of Terminals:

    100

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • PWM Channels:

    YES

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TFBGA

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY, THIN PROFILE, FINE PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • ROM Programmability:

    FLASH

  • Seated Height-Max:

    1.2 mm

  • Speed:

    100 MHz

  • Supply Voltage-Max:

    3.6 V

  • Supply Voltage-Min:

    2.4 V

  • Supply Voltage-Nom:

    3.3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Tin/Silver (Sn/Ag)

  • Terminal Form:

    BALL

  • Terminal Pitch:

    0.8 mm

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    9 mm

  • uPs/uCs/Peripheral ICs Type:

    MICROCONTROLLER, RISC

LPC1768FET100 Frequently Asked Questions (FAQs)

  • The maximum clock frequency that can be achieved with the internal oscillator is 25 MHz. However, it's recommended to use an external crystal oscillator for frequencies above 12 MHz for better accuracy and stability.
  • The pin multiplexing can be configured using the PINSELx registers. Each peripheral function has a specific pin multiplexing setting, which can be found in the datasheet or the user manual. The PINSELx registers need to be programmed accordingly to enable the desired peripheral function on a specific pin.
  • The maximum current that can be sourced or sunk by the GPIO pins is 4 mA. However, it's recommended to limit the current to 2 mA or less to ensure reliable operation and to prevent overheating.
  • A bootloader can be implemented using the ISP (In-System Programming) mode of the LPC1768FET100. The ISP mode allows the microcontroller to be programmed using a serial interface. The bootloader can be developed using the LPC1768FET100's ROM-based ISP driver and a communication protocol such as UART or USB.
  • The power consumption of the LPC1768FET100 varies depending on the operating mode. In active mode, the power consumption is around 100 mA at 25 MHz. In sleep mode, the power consumption is around 10 mA, and in deep sleep mode, it's around 1 mA. The exact power consumption can be found in the datasheet or the user manual.

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LPC1768FET100 Overview

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About NXP

NXP Semiconductors is a leading manufacturer of semiconductor devices with a wide range of semiconductor solutions, including microcontrollers, sensors, connectivity solutions, power management ICs, and security solutions. These products are used in a variety of applications such as automotive, industrial automation, smart homes, mobile devices, and more. NXP Semiconductors is one of the world’s largest semiconductor companies and is headquartered in Eindhoven, the Netherlands.

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Part Image LPC1768FET100,551 NXP Semiconductors

RISC Microcontroller, 32-Bit, FLASH, CORTEX-M3 CPU, 100MHz, CMOS, PBGA100