LPC1788FET208,551 - NXP

LPC1788FET208,551 Details

• Manufacturer Part Number:

  LPC1788FET208,551

• Brand Name:

  NXP Semiconductor

• Rohs Code:

  Yes

• Part Life Cycle Code:

  Active

• Part Package Code:

  BGA

• Package Description:

  15 X 15 MM, 0.70 MM HEIGHT, PLASTIC, SOT950-1, TFBGA-208

• Pin Count:

  208

• Manufacturer Package Code:

  SOT950-1

• ECCN Code:

  3A991.A.2

• HTS Code:

  8542.31.00.25

• Factory Lead Time:

  13 Weeks

• Manufacturer:

  NXP Semiconductors

• YTEOL:

  5

• Has ADC:

  YES

• Address Bus Width:

  26

• Bit Size:

  32

• Boundary Scan:

  YES

• CPU Family:

  CORTEX-M3

• Clock Frequency-Max:

  25 MHz

• DAC Channels:

  YES

• DMA Channels:

  YES

• External Data Bus Width:

  32

• JESD-30 Code:

  S-PBGA-B208

• JESD-609 Code:

  e1

• Length:

  15 mm

• Moisture Sensitivity Level:

  2

• Number of I/O Lines:

  165

• Number of Terminals:

  208

• On Chip Program ROM Width:

  8

• Operating Temperature-Max:

  85 °C

• Operating Temperature-Min:

  -40 °C

• PWM Channels:

  YES

• Package Body Material:

  PLASTIC/EPOXY

• Package Code:

  TFBGA

• Package Equivalence Code:

  BGA208,17X17,32

• Package Shape:

  SQUARE

• Package Style:

  GRID ARRAY, THIN PROFILE, FINE PITCH

• Peak Reflow Temperature (Cel):

  260

• Qualification Status:

  Not Qualified

• RAM (bytes):

  98304

• ROM (words):

  524288

• ROM Programmability:

  FLASH

• Seated Height-Max:

  1.2 mm

• Speed:

  120 MHz

• Supply Voltage-Max:

  3.6 V

• Supply Voltage-Min:

  3.3 V

• Supply Voltage-Nom:

  3.3 V

• Surface Mount:

  YES

• Technology:

  CMOS

• Temperature Grade:

  INDUSTRIAL

• Terminal Finish:

  Tin/Silver/Copper (Sn/Ag/Cu)

• Terminal Form:

  BALL

• Terminal Pitch:

  0.8 mm

• Terminal Position:

  BOTTOM

• Time@Peak Reflow Temperature-Max (s):

  30

• Width:

  15 mm

• uPs/uCs/Peripheral ICs Type:

  MICROCONTROLLER, RISC