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LPC1820FBD144 - NXP

Description: NXP Semiconductors LPC1820FBD144/LQFP144///STANDARD MARKING * TRAY DR

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LPC1820FBD144 - NXP PCB footprint - Quad Flat Packages - Quad Flat Packages - LQFP-144
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LPC1820FBD144 - NXP  - 3D model - Quad Flat Packages - LQFP-144
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LPC1820FBD144 Details

  • Manufacturer Part Number:

    LPC1820FBD144

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    QFP

  • Package Description:

    20 X 20 MM, 1.40 MM HEIGHT, PLASTIC, MS-026, SOT486-1, LQFP-144

  • Pin Count:

    144

  • Country Of Origin:

    Taiwan

  • ECCN Code:

    3A991.A.2

  • HTS Code:

    8542.31.00.25

  • Manufacturer:

    NXP Semiconductors

  • YTEOL:

    5.47

  • Has ADC:

    YES

  • Address Bus Width:

    24

  • Bit Size:

    32

  • Boundary Scan:

    YES

  • Clock Frequency-Max:

    25 MHz

  • DAC Channels:

    YES

  • DMA Channels:

    YES

  • External Data Bus Width:

    32

  • JESD-30 Code:

    S-PQFP-G144

  • JESD-609 Code:

    e3

  • Length:

    20 mm

  • Moisture Sensitivity Level:

    3

  • Number of I/O Lines:

    83

  • Number of Terminals:

    144

  • On Chip Program ROM Width:

    8

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • PWM Channels:

    YES

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    LFQFP

  • Package Shape:

    SQUARE

  • Package Style:

    FLATPACK, LOW PROFILE, FINE PITCH

  • Peak Reflow Temperature (Cel):

    260

  • ROM (words):

    65536

  • ROM Programmability:

    FLASH

  • Seated Height-Max:

    1.6 mm

  • Speed:

    180 MHz

  • Supply Voltage-Max:

    3.6 V

  • Supply Voltage-Min:

    2.2 V

  • Supply Voltage-Nom:

    3.3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    QUAD

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    20 mm

  • uPs/uCs/Peripheral ICs Type:

    MICROCONTROLLER, RISC

LPC1820FBD144 Frequently Asked Questions (FAQs)

  • The maximum operating temperature range for the LPC1820FBD144 is -40°C to +105°C, as specified in the datasheet. However, it's essential to note that the device's performance and reliability may degrade at extreme temperatures.
  • The clock settings for the LPC1820FBD144 can be configured using the Clock Generation Unit (CGU) registers. The CGU provides a flexible clock generation system that allows you to configure the clock sources, dividers, and multipliers to generate the desired clock frequencies for the CPU, peripherals, and other components.
  • The maximum current consumption of the LPC1820FBD144 depends on the operating frequency, voltage, and peripheral usage. According to the datasheet, the typical current consumption is around 130 mA at 100 MHz, 3.3 V, and 25°C. However, this value can vary depending on the specific application and usage.
  • The LPC1820FBD144 provides several low-power modes, including Sleep, Deep Sleep, and Power-Down modes. These modes can be implemented using the Power Management Controller (PMC) registers. By configuring the PMC registers, you can reduce the power consumption of the device to minimize energy usage and prolong battery life in battery-powered applications.
  • The maximum flash memory endurance of the LPC1820FBD144 is 100,000 erase/program cycles, as specified in the datasheet. This means that the flash memory can withstand up to 100,000 erase and program operations before its reliability starts to degrade.

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LPC1820FBD144 Overview

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About NXP

NXP Semiconductors is a leading manufacturer of semiconductor devices with a wide range of semiconductor solutions, including microcontrollers, sensors, connectivity solutions, power management ICs, and security solutions. These products are used in a variety of applications such as automotive, industrial automation, smart homes, mobile devices, and more. NXP Semiconductors is one of the world’s largest semiconductor companies and is headquartered in Eindhoven, the Netherlands.

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