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LPC18S57JBD208E - NXP

Description:  Processor core  ARM Cortex-M3 processor (version r2p1), running at CPU frequencies of up to 180 MHz.  ARM Cortex-M3 built-in Memory Protection Unit (MPU) supporting eight regions.  ARM Cortex-M3 built-in Nested Vectored Interrupt Controller (NVIC).  Non-maskable Interrupt (NMI) input.  JTAG and Serial Wire Debug, serial trace, eight breakpoints, and four watch points.  Enhanced Trace Module (ETM) and Enhanced Trace Buffer (ETB) support.  System tick timer.  On-chip memory  Up to 1 MB on

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LPC18S57JBD208E - NXP PCB footprint - Quad Flat Packages - Quad Flat Packages - LQFP208
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LPC18S57JBD208E - NXP  - 3D model - Quad Flat Packages - LQFP208
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LPC18S57JBD208E Details

  • Manufacturer Part Number:

    LPC18S57JBD208E

  • Brand Name:

    NXP Semiconductor

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    QFP

  • Package Description:

    LQFP-208

  • Pin Count:

    208

  • Manufacturer Package Code:

    SOT459-1

  • Country Of Origin:

    Taiwan

  • ECCN Code:

    5A992

  • HTS Code:

    8542.31.00.25

  • Factory Lead Time:

    13 Weeks

  • Manufacturer:

    NXP Semiconductors

  • YTEOL:

    5

  • Has ADC:

    YES

  • Address Bus Width:

    24

  • Bit Size:

    32

  • Boundary Scan:

    YES

  • CPU Family:

    CORTEX-M3

  • Clock Frequency-Max:

    25 MHz

  • DAC Channels:

    YES

  • DMA Channels:

    YES

  • External Data Bus Width:

    32

  • Format:

    FIXED POINT

  • Integrated Cache:

    NO

  • JESD-30 Code:

    S-PQFP-G208

  • JESD-609 Code:

    e3

  • Length:

    28 mm

  • Low Power Mode:

    YES

  • Moisture Sensitivity Level:

    3

  • Number of DMA Channels:

    8

  • Number of External Interrupts:

    1

  • Number of I/O Lines:

    142

  • Number of Serial I/Os:

    9

  • Number of Terminals:

    208

  • Number of Timers:

    7

  • On Chip Data RAM Width:

    8

  • On Chip Program ROM Width:

    8

  • Operating Temperature-Max:

    105 °C

  • Operating Temperature-Min:

    -40 °C

  • PWM Channels:

    YES

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    LFQFP

  • Package Equivalence Code:

    QFP208,1.2SQ,20

  • Package Shape:

    SQUARE

  • Package Style:

    FLATPACK, LOW PROFILE, FINE PITCH

  • Peak Reflow Temperature (Cel):

    260

  • RAM (bytes):

    139264

  • ROM (words):

    1048576

  • ROM Programmability:

    FLASH

  • Seated Height-Max:

    1.6 mm

  • Speed:

    180 MHz

  • Supply Current-Max:

    100 mA

  • Supply Voltage-Max:

    3.6 V

  • Supply Voltage-Min:

    2.4 V

  • Supply Voltage-Nom:

    3.3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Terminal Finish:

    Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    QUAD

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    28 mm

  • uPs/uCs/Peripheral ICs Type:

    MICROCONTROLLER, RISC

LPC18S57JBD208E Frequently Asked Questions (FAQs)

  • The maximum operating temperature range for the LPC18S57JBD208E is -40°C to +105°C.
  • The clock settings for the LPC18S57JBD208E can be configured using the Clock Control Unit (CCU) registers. The CCU provides a flexible clock generation and distribution system that allows the user to configure the clock frequencies and sources for the various peripherals and domains.
  • The maximum frequency for the LPC18S57JBD208E's CPU is 180 MHz.
  • The LPC18S57JBD208E's DMA controller can be used to transfer data between peripherals and memory without CPU intervention. The DMA controller is configured using the DMA registers and can be triggered by various peripherals such as UART, SPI, and I2C.
  • The LPC18S57JBD208E has 1 MB of flash memory.

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About NXP

NXP Semiconductors is a leading manufacturer of semiconductor devices with a wide range of semiconductor solutions, including microcontrollers, sensors, connectivity solutions, power management ICs, and security solutions. These products are used in a variety of applications such as automotive, industrial automation, smart homes, mobile devices, and more. NXP Semiconductors is one of the world’s largest semiconductor companies and is headquartered in Eindhoven, the Netherlands.

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