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LPC2468FET208 - NXP

Description: Single-chip 16-bit/32-bit micro; 512 kB flash, Ethernet, CAN, ISP/IAP, USB 2.0 device/host/OTG, external memory interface

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PCB Footprints
LPC2468FET208 - NXP PCB footprint - BGA - BGA - SOT950-1
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LPC2468FET208 - NXP  - 3D model - BGA - SOT950-1
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LPC2468FET208 Details

  • Manufacturer Part Number:

    LPC2468FET208

  • Source Url Status Check Date:

    2013-06-14 00:00:00

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    BGA

  • Pin Count:

    208

  • Manufacturer Package Code:

    SOT-950-1

  • Country Of Origin:

    Taiwan

  • ECCN Code:

    3A991.A.2

  • HTS Code:

    8542.31.00.25

  • Manufacturer:

    NXP Semiconductors

  • YTEOL:

    8.08

  • Has ADC:

    YES

  • Address Bus Width:

    24

  • Bit Size:

    32

  • Boundary Scan:

    YES

  • CPU Family:

    ARM7

  • Clock Frequency-Max:

    25 MHz

  • DAC Channels:

    YES

  • DMA Channels:

    YES

  • External Data Bus Width:

    32

  • Format:

    FIXED POINT

  • Integrated Cache:

    NO

  • JESD-30 Code:

    S-PBGA-B208

  • JESD-609 Code:

    e1

  • Length:

    15 mm

  • Low Power Mode:

    YES

  • Moisture Sensitivity Level:

    2

  • Number of DMA Channels:

    1

  • Number of External Interrupts:

    4

  • Number of I/O Lines:

    160

  • Number of Serial I/Os:

    4

  • Number of Terminals:

    208

  • Number of Timers:

    4

  • On Chip Data RAM Width:

    32

  • On Chip Program ROM Width:

    128

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • PWM Channels:

    YES

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TFBGA

  • Package Equivalence Code:

    BGA208,17X17,32

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY, THIN PROFILE, FINE PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • RAM (bytes):

    65536

  • RAM (words):

    16384

  • ROM (words):

    32768

  • ROM Programmability:

    FLASH

  • Seated Height-Max:

    1.2 mm

  • Speed:

    72 MHz

  • Supply Current-Max:

    100 mA

  • Supply Voltage-Max:

    3.6 V

  • Supply Voltage-Min:

    3.3 V

  • Supply Voltage-Nom:

    3.3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Tin/Silver/Copper (Sn/Ag/Cu)

  • Terminal Form:

    BALL

  • Terminal Pitch:

    0.8 mm

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    15 mm

  • uPs/uCs/Peripheral ICs Type:

    MICROCONTROLLER, RISC

LPC2468FET208 Frequently Asked Questions (FAQs)

  • The maximum operating temperature range for the LPC2468FET208 is -40°C to +105°C, but this can be limited by the specific application and the PCB design.
  • The clock settings for the LPC2468FET208 can be configured using the PLL (Phase-Locked Loop) and the Clock Generation Unit (CGU). The PLL can be used to generate a clock frequency up to 400 MHz, and the CGU can be used to divide the clock frequency to generate the desired clock speed for the CPU, peripherals, and other components.
  • The maximum amount of current that the LPC2468FET208 can supply to its I/O pins is 4 mA per pin, but this can be limited by the specific application and the PCB design. It's recommended to use an external buffer or driver if more current is required.
  • The LPC2468FET208 has a built-in watchdog timer that can be enabled and configured using the Watchdog Timer (WDT) registers. The watchdog timer can be used to reset the microcontroller if it fails to respond within a specified time period.
  • The LPC2468FET208 has 512 KB of flash memory, but only 496 KB is available for program storage. The remaining 16 KB is reserved for the bootloader and other system functions.

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LPC2468FET208 Overview

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About NXP

NXP Semiconductors is a leading manufacturer of semiconductor devices with a wide range of semiconductor solutions, including microcontrollers, sensors, connectivity solutions, power management ICs, and security solutions. These products are used in a variety of applications such as automotive, industrial automation, smart homes, mobile devices, and more. NXP Semiconductors is one of the world’s largest semiconductor companies and is headquartered in Eindhoven, the Netherlands.

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