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LPC2478FET208 - NXP

Description: ARM7® LPC2400 Microcontroller IC 16/32-Bit 72MHz 512KB (512K x 8) FLASH 208-TFBGA (15x15)

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PCB Footprints
LPC2478FET208 - NXP PCB footprint - BGA - BGA - SOT950-1
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LPC2478FET208 - NXP  - 3D model - BGA - SOT950-1
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LPC2478FET208 Details

  • Manufacturer Part Number:

    LPC2478FET208

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    BGA

  • Pin Count:

    208

  • Manufacturer Package Code:

    SOT-950-1

  • Country Of Origin:

    Taiwan

  • ECCN Code:

    3A991.A.2

  • HTS Code:

    8542.31.00.25

  • Manufacturer:

    NXP Semiconductors

  • YTEOL:

    8

  • Has ADC:

    YES

  • Address Bus Width:

    24

  • Bit Size:

    32

  • Boundary Scan:

    YES

  • CPU Family:

    ARM7

  • Clock Frequency-Max:

    25 MHz

  • DAC Channels:

    YES

  • DMA Channels:

    YES

  • External Data Bus Width:

    32

  • Format:

    FIXED POINT

  • Integrated Cache:

    NO

  • JESD-30 Code:

    S-PBGA-B208

  • JESD-609 Code:

    e1

  • Length:

    15 mm

  • Low Power Mode:

    YES

  • Moisture Sensitivity Level:

    2

  • Number of DMA Channels:

    1

  • Number of External Interrupts:

    4

  • Number of I/O Lines:

    160

  • Number of Serial I/Os:

    4

  • Number of Terminals:

    208

  • Number of Timers:

    4

  • On Chip Data RAM Width:

    32

  • On Chip Program ROM Width:

    128

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • PWM Channels:

    YES

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TFBGA

  • Package Equivalence Code:

    BGA208,17X17,32

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY, THIN PROFILE, FINE PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • RAM (bytes):

    65536

  • RAM (words):

    16384

  • ROM (words):

    32768

  • ROM Programmability:

    FLASH

  • Seated Height-Max:

    1.2 mm

  • Speed:

    72 MHz

  • Supply Current-Max:

    100 mA

  • Supply Voltage-Max:

    3.6 V

  • Supply Voltage-Min:

    3.3 V

  • Supply Voltage-Nom:

    3.3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Tin/Silver/Copper (Sn/Ag/Cu)

  • Terminal Form:

    BALL

  • Terminal Pitch:

    0.8 mm

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    15 mm

  • uPs/uCs/Peripheral ICs Type:

    MICROCONTROLLER, RISC

LPC2478FET208 Frequently Asked Questions (FAQs)

  • The maximum operating temperature range for the LPC2478FET208 is -40°C to +105°C, but it can be extended to -40°C to +125°C with some limitations on the clock frequency and voltage supply.
  • The EMI configuration for the LPC2478FET208 involves setting the EMI registers, configuring the memory timing, and enabling the EMI clock. Refer to the LPC2478 user manual and the example code provided by NXP for more details.
  • Yes, the LPC2478FET208 can operate with a 3.3V power supply, but it requires an external voltage regulator to generate the internal 1.2V core voltage. Additionally, some peripherals may not function correctly at 3.3V, so ensure to check the datasheet and user manual for specific details.
  • The LPC2478FET208 has a built-in ROM-based boot loader that can be used to implement a secure boot mechanism. This involves generating a secure boot image, storing it in the on-chip flash, and configuring the boot loader to authenticate the image before booting. Refer to the LPC2478 user manual and the NXP secure boot application note for more details.
  • The maximum clock frequency for the LPC2478FET208 is 72 MHz, but it can be overclocked to 100 MHz with some limitations on the voltage supply and temperature range.

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LPC2478FET208 Overview

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About NXP

NXP Semiconductors is a leading manufacturer of semiconductor devices with a wide range of semiconductor solutions, including microcontrollers, sensors, connectivity solutions, power management ICs, and security solutions. These products are used in a variety of applications such as automotive, industrial automation, smart homes, mobile devices, and more. NXP Semiconductors is one of the world’s largest semiconductor companies and is headquartered in Eindhoven, the Netherlands.

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