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LPC4078FBD208 - NXP

Description: 32-Bit Arm® Cortex®-M4 MCU; Up to 512 KB Flash, 96 KB SRAM; USB Device/Host/OTG; Ethernet; EMC; SPIFI

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Symbol
LPC4078FBD208 - NXP - PCB symbol
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PCB Footprints
LPC4078FBD208 - NXP PCB footprint - Quad Flat Packages - Quad Flat Packages - SOT459-1
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3D Models
LPC4078FBD208 - NXP - 3D model - Quad Flat Packages - SOT459-1
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LPC4078FBD208 Details

  • Manufacturer Part Number:

    LPC4078FBD208

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    LQFP-208

  • Country Of Origin:

    Taiwan

  • ECCN Code:

    3A991.A.2

  • HTS Code:

    8542.31.00.25

  • Manufacturer:

    NXP Semiconductors

  • YTEOL:

    5

  • Has ADC:

    YES

  • Address Bus Width:

    26

  • Bit Size:

    32

  • Clock Frequency-Max:

    25 MHz

  • DAC Channels:

    YES

  • DMA Channels:

    YES

  • External Data Bus Width:

    32

  • JESD-30 Code:

    S-PQFP-G208

  • JESD-609 Code:

    e3

  • Length:

    28 mm

  • Moisture Sensitivity Level:

    2

  • Number of Terminals:

    208

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • PWM Channels:

    YES

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    LFQFP

  • Package Shape:

    SQUARE

  • Package Style:

    FLATPACK, LOW PROFILE, FINE PITCH

  • Peak Reflow Temperature (Cel):

    260

  • ROM Programmability:

    FLASH

  • Seated Height-Max:

    1.6 mm

  • Speed:

    120 MHz

  • Supply Voltage-Max:

    3.6 V

  • Supply Voltage-Min:

    2.4 V

  • Supply Voltage-Nom:

    3.3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    QUAD

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    28 mm

  • uPs/uCs/Peripheral ICs Type:

    MICROCONTROLLER, RISC

LPC4078FBD208 Frequently Asked Questions (FAQs)

  • The maximum operating temperature range for the LPC4078FBD208 is -40°C to +105°C, as specified in the datasheet. However, it's recommended to operate within -20°C to +85°C for optimal performance and reliability.
  • The clock settings for the LPC4078FBD208 can be configured using the Clock Generation Unit (CGU) registers. The CGU provides a flexible clock generation system that allows you to configure the clock sources, dividers, and multipliers to generate the desired clock frequencies for the CPU, peripherals, and other components.
  • The maximum current consumption of the LPC4078FBD208 depends on the operating frequency, voltage, and peripheral usage. According to the datasheet, the typical current consumption is around 130 mA at 100 MHz, 3.3 V, and 25°C. However, this value can vary depending on the specific application and usage.
  • The LPC4078FBD208 has several low-power modes, including Sleep, Deep Sleep, and Power-Down modes. These modes can be implemented using the Power Management Controller (PMC) registers. The PMC allows you to configure the power modes, clock gating, and voltage scaling to minimize power consumption and optimize system performance.
  • The maximum flash memory endurance of the LPC4078FBD208 is 100,000 erase/write cycles, as specified in the datasheet. However, this value can vary depending on the operating conditions, programming methods, and data retention requirements.

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LPC4078FBD208 Overview

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About NXP

NXP Semiconductors is a leading manufacturer of semiconductor devices with a wide range of semiconductor solutions, including microcontrollers, sensors, connectivity solutions, power management ICs, and security solutions. These products are used in a variety of applications such as automotive, industrial automation, smart homes, mobile devices, and more. NXP Semiconductors is one of the world’s largest semiconductor companies and is headquartered in Eindhoven, the Netherlands.

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