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LPC4088FBD208 - NXP

Description: IC: ARM microcontroller; 96kBSRAM; Flash: 512kB; LQFP208; 120MHz

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PCB Footprints
LPC4088FBD208 - NXP PCB footprint - Quad Flat Packages - Quad Flat Packages - LQFP208
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LPC4088FBD208 - NXP  - 3D model - Quad Flat Packages - LQFP208
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LPC4088FBD208 Details

  • Manufacturer Part Number:

    LPC4088FBD208

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    LQFP-208

  • Country Of Origin:

    Taiwan

  • ECCN Code:

    3A991.A.2

  • HTS Code:

    8542.31.00.25

  • Manufacturer:

    NXP Semiconductors

  • YTEOL:

    5

  • Has ADC:

    YES

  • Address Bus Width:

    26

  • Bit Size:

    32

  • CPU Family:

    CORTEX-M4

  • Clock Frequency-Max:

    25 MHz

  • DAC Channels:

    YES

  • DMA Channels:

    YES

  • External Data Bus Width:

    32

  • JESD-30 Code:

    S-PQFP-G208

  • JESD-609 Code:

    e3

  • Length:

    28 mm

  • Moisture Sensitivity Level:

    2

  • Number of Terminals:

    208

  • On Chip Program ROM Width:

    8

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • PWM Channels:

    YES

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    LFQFP

  • Package Shape:

    SQUARE

  • Package Style:

    FLATPACK, LOW PROFILE, FINE PITCH

  • Peak Reflow Temperature (Cel):

    260

  • RAM (bytes):

    98304

  • ROM (words):

    524288

  • ROM Programmability:

    FLASH

  • Seated Height-Max:

    1.6 mm

  • Speed:

    120 MHz

  • Supply Voltage-Max:

    3.6 V

  • Supply Voltage-Min:

    2.4 V

  • Supply Voltage-Nom:

    3.3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    QUAD

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    28 mm

  • uPs/uCs/Peripheral ICs Type:

    MICROCONTROLLER, RISC

LPC4088FBD208 Frequently Asked Questions (FAQs)

  • The maximum operating temperature range for the LPC4088FBD208 is -40°C to +105°C, but this can be limited by the specific application and the PCB design.
  • The clock settings for the LPC4088FBD208 can be configured using the Clock Generation Unit (CGU) registers. The CGU provides a flexible clock generation system that allows the user to configure the clock sources, dividers, and multipliers to generate the desired clock frequencies.
  • The maximum current consumption of the LPC4088FBD208 depends on the operating frequency, voltage, and peripheral usage. According to the datasheet, the typical current consumption is around 130 mA at 100 MHz and 3.3 V, but this can increase to around 250 mA at maximum operating conditions.
  • The LPC4088FBD208 has a USB 2.0 full-speed device controller that can be used to implement USB device functionality. The USB interface can be configured using the USB registers and the USB library provided in the LPC4088FBD208 software development kit (SDK).
  • The LPC4088FBD208 has 512 KB of flash memory and 96 KB of SRAM, as well as 4 KB of EEPROM and 16 KB of OTP (one-time programmable) memory.

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About NXP

NXP Semiconductors is a leading manufacturer of semiconductor devices with a wide range of semiconductor solutions, including microcontrollers, sensors, connectivity solutions, power management ICs, and security solutions. These products are used in a variety of applications such as automotive, industrial automation, smart homes, mobile devices, and more. NXP Semiconductors is one of the world’s largest semiconductor companies and is headquartered in Eindhoven, the Netherlands.

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