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LPC4313JBD144E - NXP

Description: ARM Microcontrollers - MCU Arm Cortex-M4 Microcontroller Unit

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LPC4313JBD144E - NXP - PCB symbol
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PCB Footprints
LPC4313JBD144E - NXP PCB footprint - Quad Flat Packages - Quad Flat Packages - LQFP144/t
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LPC4313JBD144E - NXP - 3D model - Quad Flat Packages - LQFP144/t
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LPC4313JBD144E Details

  • Manufacturer Part Number:

    LPC4313JBD144E

  • Brand Name:

    NXP Semiconductor

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    QFP

  • Package Description:

    20 X 20 MM, 1.40 MM HEIGHT, PLASTIC, SOT486-1, MS-026, LQFP-144

  • Pin Count:

    144

  • Manufacturer Package Code:

    SOT486-1

  • Country Of Origin:

    Taiwan

  • ECCN Code:

    3A991.A.2

  • HTS Code:

    8542.31.00.25

  • Manufacturer:

    NXP Semiconductors

  • YTEOL:

    5

  • Has ADC:

    YES

  • Address Bus Width:

    24

  • Bit Size:

    32

  • Boundary Scan:

    YES

  • CPU Family:

    CORTEX-M4

  • Clock Frequency-Max:

    25 MHz

  • DAC Channels:

    YES

  • DMA Channels:

    YES

  • External Data Bus Width:

    32

  • JESD-30 Code:

    S-PQFP-G144

  • JESD-609 Code:

    e3

  • Length:

    20 mm

  • Moisture Sensitivity Level:

    3

  • Number of I/O Lines:

    83

  • Number of Terminals:

    144

  • On Chip Program ROM Width:

    8

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • PWM Channels:

    YES

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    LFQFP

  • Package Equivalence Code:

    QFP144,.87SQ,20

  • Package Shape:

    SQUARE

  • Package Style:

    FLATPACK, LOW PROFILE, FINE PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • RAM (bytes):

    106496

  • ROM (words):

    524288

  • ROM Programmability:

    FLASH

  • Seated Height-Max:

    1.6 mm

  • Speed:

    204 MHz

  • Supply Voltage-Max:

    3.6 V

  • Supply Voltage-Min:

    3.3 V

  • Supply Voltage-Nom:

    3.3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    QUAD

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    20 mm

  • uPs/uCs/Peripheral ICs Type:

    MICROCONTROLLER, RISC

LPC4313JBD144E Frequently Asked Questions (FAQs)

  • The maximum operating temperature range for the LPC4313JBD144E is -40°C to +105°C, as specified in the datasheet. However, it's essential to note that the device's performance and reliability may degrade at extreme temperatures.
  • The clock settings for the LPC4313JBD144E can be configured using the Clock Generation Unit (CGU) registers. The CGU provides a flexible clocking scheme, allowing you to select from various clock sources, such as the internal RC oscillator, external crystal oscillator, or PLL. Refer to the LPC4313 user manual for detailed information on clock configuration.
  • The maximum current consumption of the LPC4313JBD144E depends on the operating frequency, voltage, and peripherals used. According to the datasheet, the typical current consumption is around 130 mA at 100 MHz, 3.3 V, and with all peripherals enabled. However, this value can vary depending on the specific application and usage.
  • The LPC4313JBD144E has a built-in Secure Boot feature that ensures the authenticity and integrity of the firmware. To implement secure boot, you need to generate a secure boot key, create a secure boot image, and configure the boot pins accordingly. NXP provides a Secure Boot tool and documentation to guide you through the process.
  • Yes, the LPC4313JBD144E has an external memory interface that supports various memory types, including SDRAM, SRAM, and Flash. You can use the External Memory Controller (EMC) to configure the interface and access external memory devices. Refer to the LPC4313 user manual for details on EMC configuration and timing parameters.

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LPC4313JBD144E Overview

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About NXP

NXP Semiconductors is a leading manufacturer of semiconductor devices with a wide range of semiconductor solutions, including microcontrollers, sensors, connectivity solutions, power management ICs, and security solutions. These products are used in a variety of applications such as automotive, industrial automation, smart homes, mobile devices, and more. NXP Semiconductors is one of the world’s largest semiconductor companies and is headquartered in Eindhoven, the Netherlands.

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