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LPC43S57JBD208E - NXP

Description: ARM Microcontrollers - MCU 32-bit ARM Cortex-M4/M0 MCU; 1 MB flash and 136 kB SRAM; Ethernet, 2 x USB, LCD, EMC, AES engine

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LPC43S57JBD208E - NXP PCB footprint - Quad Flat Packages - Quad Flat Packages - LQFP208
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LPC43S57JBD208E - NXP  - 3D model - Quad Flat Packages - LQFP208
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LPC43S57JBD208E Details

  • Manufacturer Part Number:

    LPC43S57JBD208E

  • Brand Name:

    NXP Semiconductor

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    QFP

  • Package Description:

    LQFP-208

  • Pin Count:

    208

  • Manufacturer Package Code:

    SOT459-1

  • Country Of Origin:

    Taiwan

  • ECCN Code:

    5A992

  • HTS Code:

    8542.31.00.25

  • Factory Lead Time:

    13 Weeks

  • Manufacturer:

    NXP Semiconductors

  • YTEOL:

    5

  • Has ADC:

    YES

  • Address Bus Width:

    24

  • Bit Size:

    32

  • Boundary Scan:

    YES

  • CPU Family:

    CORTEX-M4

  • Clock Frequency-Max:

    25 MHz

  • DAC Channels:

    YES

  • DMA Channels:

    YES

  • External Data Bus Width:

    26

  • Format:

    FLOATING POINT

  • Integrated Cache:

    NO

  • JESD-30 Code:

    S-PQFP-G208

  • JESD-609 Code:

    e3

  • Length:

    28 mm

  • Low Power Mode:

    YES

  • Moisture Sensitivity Level:

    3

  • Number of DMA Channels:

    8

  • Number of External Interrupts:

    5

  • Number of I/O Lines:

    142

  • Number of Serial I/Os:

    9

  • Number of Terminals:

    208

  • Number of Timers:

    7

  • On Chip Data RAM Width:

    8

  • On Chip Program ROM Width:

    8

  • Operating Temperature-Max:

    105 °C

  • Operating Temperature-Min:

    -40 °C

  • PWM Channels:

    YES

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    LFQFP

  • Package Equivalence Code:

    QFP208,1.2SQ,20

  • Package Shape:

    SQUARE

  • Package Style:

    FLATPACK, LOW PROFILE, FINE PITCH

  • Peak Reflow Temperature (Cel):

    260

  • RAM (bytes):

    139264

  • ROM (words):

    1048576

  • ROM Programmability:

    FLASH

  • Seated Height-Max:

    1.6 mm

  • Speed:

    204 MHz

  • Supply Current-Max:

    100 mA

  • Supply Voltage-Max:

    3.6 V

  • Supply Voltage-Min:

    2.4 V

  • Supply Voltage-Nom:

    3.3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Terminal Finish:

    Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    QUAD

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    28 mm

  • uPs/uCs/Peripheral ICs Type:

    MICROCONTROLLER, RISC

LPC43S57JBD208E Frequently Asked Questions (FAQs)

  • The maximum operating temperature range for the LPC43S57JBD208E is -40°C to +105°C.
  • The clock settings for the LPC43S57JBD208E can be configured using the Clock Control Unit (CCU) registers. The CCU provides a flexible clock generation and distribution system that allows the user to configure the clock frequencies and sources for the various peripherals and domains.
  • The maximum frequency for the LPC43S57JBD208E is 204 MHz.
  • The ADC on the LPC43S57JBD208E is a 12-bit successive approximation ADC with a maximum sampling rate of 1.2 Msamples/s. To use the ADC, the user must configure the ADC clock, select the ADC channel, and start the ADC conversion. The ADC result can be read from the ADC result register.
  • The Boot ROM on the LPC43S57JBD208E contains the boot loader code that is executed when the device is powered on or reset. The Boot ROM provides a way to boot the device from an external memory device, such as a serial flash or a SD/MMC card.

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LPC43S57JBD208E Overview

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About NXP

NXP Semiconductors is a leading manufacturer of semiconductor devices with a wide range of semiconductor solutions, including microcontrollers, sensors, connectivity solutions, power management ICs, and security solutions. These products are used in a variety of applications such as automotive, industrial automation, smart homes, mobile devices, and more. NXP Semiconductors is one of the world’s largest semiconductor companies and is headquartered in Eindhoven, the Netherlands.

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