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LPC51U68JBD64QL - NXP

Description: ARM Microcontrollers - MCU 32-bit ARM Cortex-M4

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PCB Footprints
LPC51U68JBD64QL - NXP PCB footprint - Quad Flat Packages - Quad Flat Packages - LQFP64: plastic low profile quad flat package; 64 leads; body 10 x 10 x 1.4 mm
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3D Models
LPC51U68JBD64QL - NXP  - 3D model - Quad Flat Packages - LQFP64: plastic low profile quad flat package; 64 leads; body 10 x 10 x 1.4 mm
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  • Datasheet Download Datasheet
  • Stock & Prices $ Price & Stock for LPC51U68JBD64QL
  • Part Number LPC51U68JBD64QL
  • Manufacturer NXP
  • Pin Count 64
  • Part Category Integrated Circuit
  • Package Category Quad Flat Packages
  • Footprint Name Quad Flat Packages - LQFP64: plastic low profile quad flat package; 64 leads; body 10 x 10 x 1.4 mm
  • Released Date Mar 29, 2020
  • Last Modified Date Mar 7, 2023 4:10 PM UTC
  • Pinout / Pin List Click Here (Member Only)

LPC51U68JBD64QL Details

  • Manufacturer Part Number:

    LPC51U68JBD64QL

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    LQFP-64

  • Country Of Origin:

    Taiwan

  • ECCN Code:

    3A991.A.2

  • HTS Code:

    8542.31.00.25

  • Manufacturer:

    NXP Semiconductors

  • YTEOL:

    7

  • Has ADC:

    YES

  • Bit Size:

    32

  • Boundary Scan:

    YES

  • CPU Family:

    Cortex-M0+

  • Clock Frequency-Max:

    25 MHz

  • DAC Channels:

    NO

  • DMA Channels:

    YES

  • Format:

    FIXED POINT

  • Integrated Cache:

    NO

  • JESD-30 Code:

    S-PQFP-G64

  • JESD-609 Code:

    e3

  • Length:

    10 mm

  • Low Power Mode:

    YES

  • Moisture Sensitivity Level:

    1

  • Number of DMA Channels:

    18

  • Number of External Interrupts:

    4

  • Number of I/O Lines:

    48

  • Number of Serial I/Os:

    8

  • Number of Terminals:

    64

  • Number of Timers:

    7

  • On Chip Data RAM Width:

    8

  • On Chip Program ROM Width:

    8

  • Operating Temperature-Max:

    105 °C

  • Operating Temperature-Min:

    -40 °C

  • PWM Channels:

    YES

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    LFQFP

  • Package Equivalence Code:

    QFP64,.47SQ,20

  • Package Shape:

    SQUARE

  • Package Style:

    FLATPACK, LOW PROFILE, FINE PITCH

  • Peak Reflow Temperature (Cel):

    260

  • RAM (bytes):

    98304

  • ROM (words):

    262144

  • ROM Programmability:

    FLASH

  • Seated Height-Max:

    1.6 mm

  • Speed:

    100 MHz

  • Supply Current-Max:

    60 mA

  • Supply Voltage-Max:

    3.6 V

  • Supply Voltage-Min:

    1.62 V

  • Supply Voltage-Nom:

    3.3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Terminal Finish:

    Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    QUAD

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    10 mm

  • uPs/uCs/Peripheral ICs Type:

    MICROCONTROLLER, RISC

LPC51U68JBD64QL Frequently Asked Questions (FAQs)

  • The maximum clock frequency of the LPC51U68JBD64QL is 72 MHz.
  • The LPC51U68JBD64QL has 64 KB of flash memory.
  • The maximum operating temperature range of the LPC51U68JBD64QL is -40°C to 105°C.
  • Yes, the LPC51U68JBD64QL has a built-in USB 2.0 full-speed device controller.
  • The LPC51U68JBD64QL has 2 UARTs.

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LPC51U68JBD64QL Overview

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About NXP

NXP Semiconductors is a leading manufacturer of semiconductor devices with a wide range of semiconductor solutions, including microcontrollers, sensors, connectivity solutions, power management ICs, and security solutions. These products are used in a variety of applications such as automotive, industrial automation, smart homes, mobile devices, and more. NXP Semiconductors is one of the world’s largest semiconductor companies and is headquartered in Eindhoven, the Netherlands.

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