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LPC54113J256BD64QL - NXP

Description: ARM Microcontrollers - MCU Low Power 32-bit Microcontroller based on ARM Cortex-M4

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PCB Footprints
LPC54113J256BD64QL - NXP PCB footprint - Quad Flat Packages - Quad Flat Packages - LQFP64: plastic low profile quad flat package; 64 leads; body 10 x 10 x 1.4 mm
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3D Models
LPC54113J256BD64QL - NXP  - 3D model - Quad Flat Packages - LQFP64: plastic low profile quad flat package; 64 leads; body 10 x 10 x 1.4 mm
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LPC54113J256BD64QL Details

  • Manufacturer Part Number:

    LPC54113J256BD64QL

  • Brand Name:

    NXP Semiconductor

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    QFP

  • Package Description:

    LQFP-64

  • Pin Count:

    64

  • Manufacturer Package Code:

    SOT314-2

  • Country Of Origin:

    Taiwan

  • ECCN Code:

    3A991.A.2

  • HTS Code:

    8542.31.00.25

  • Factory Lead Time:

    13 Weeks

  • Manufacturer:

    NXP Semiconductors

  • YTEOL:

    5

  • Has ADC:

    YES

  • Bit Size:

    32

  • Boundary Scan:

    YES

  • CPU Family:

    CORTEX-M4

  • Clock Frequency-Max:

    25 MHz

  • DAC Channels:

    NO

  • DMA Channels:

    YES

  • Format:

    FLOATING POINT

  • Integrated Cache:

    NO

  • JESD-30 Code:

    S-PQFP-G64

  • JESD-609 Code:

    e3

  • Length:

    10 mm

  • Low Power Mode:

    YES

  • Moisture Sensitivity Level:

    1

  • Number of DMA Channels:

    20

  • Number of External Interrupts:

    8

  • Number of I/O Lines:

    48

  • Number of Serial I/Os:

    8

  • Number of Terminals:

    64

  • Number of Timers:

    9

  • On Chip Data RAM Width:

    8

  • On Chip Program ROM Width:

    8

  • Operating Temperature-Max:

    105 °C

  • Operating Temperature-Min:

    -40 °C

  • PWM Channels:

    YES

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    LFQFP

  • Package Equivalence Code:

    QFP64,.47SQ,20

  • Package Shape:

    SQUARE

  • Package Style:

    FLATPACK, LOW PROFILE, FINE PITCH

  • Peak Reflow Temperature (Cel):

    260

  • RAM (bytes):

    196608

  • ROM (words):

    262144

  • ROM Programmability:

    FLASH

  • Seated Height-Max:

    1.6 mm

  • Speed:

    100 MHz

  • Supply Current-Max:

    60 mA

  • Supply Voltage-Max:

    3.6 V

  • Supply Voltage-Min:

    1.62 V

  • Supply Voltage-Nom:

    3.3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Terminal Finish:

    Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    QUAD

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    10 mm

  • uPs/uCs/Peripheral ICs Type:

    MICROCONTROLLER, RISC

LPC54113J256BD64QL Frequently Asked Questions (FAQs)

  • The maximum operating frequency of the LPC54113J256BD64QL is 72 MHz.
  • The LPC54113J256BD64QL has 256 KB of flash memory.
  • The LPC54113J256BD64QL has 64 KB of SRAM.
  • Yes, the LPC54113J256BD64QL has a built-in USB 2.0 full-speed device interface.
  • Yes, the LPC54113J256BD64QL has multiple low-power modes, including Sleep, Deep Sleep, and Power-Down modes, to reduce power consumption.

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LPC54113J256BD64QL Overview

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About NXP

NXP Semiconductors is a leading manufacturer of semiconductor devices with a wide range of semiconductor solutions, including microcontrollers, sensors, connectivity solutions, power management ICs, and security solutions. These products are used in a variety of applications such as automotive, industrial automation, smart homes, mobile devices, and more. NXP Semiconductors is one of the world’s largest semiconductor companies and is headquartered in Eindhoven, the Netherlands.

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