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LPC54S016JET100E - NXP

Description: ARM Microcontrollers - MCU LPC54S016JET100 ARM Cortex-M4 core (version r0p1): ARM Cortex-M4 processor, running at a frequency of up to 180 MHz. Floating Point Unit (FPU) and Memory Protection Unit (MPU). ARM Cortex-M4 built-in Nested Vectored Interrupt Controller (NVIC). Non-maskable Interrupt (NMI) input with a selection of sources. Serial Wire Debug (SWD) with six instruction breakpoints, two literal comparators, and four watch points. Includes Serial Wire Output and ETM Trace for enhanced debug c

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LPC54S016JET100E - NXP PCB footprint - BGA - BGA - SOT926-1
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LPC54S016JET100E - NXP  - 3D model - BGA - SOT926-1
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LPC54S016JET100E Details

  • Manufacturer Part Number:

    LPC54S016JET100E

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    TFBGA-100

  • Country Of Origin:

    Taiwan

  • ECCN Code:

    5A992.C

  • HTS Code:

    8542.31.00.25

  • Manufacturer:

    NXP Semiconductors

  • YTEOL:

    5

  • Has ADC:

    YES

  • Bit Size:

    32

  • Boundary Scan:

    YES

  • CPU Family:

    CORTEX-M4

  • Clock Frequency-Max:

    25 MHz

  • DAC Channels:

    NO

  • DMA Channels:

    YES

  • Format:

    FLOATING POINT

  • Integrated Cache:

    YES

  • JESD-30 Code:

    S-PBGA-B100

  • Length:

    9 mm

  • Low Power Mode:

    YES

  • Moisture Sensitivity Level:

    3

  • Number of DMA Channels:

    30

  • Number of I/O Lines:

    64

  • Number of Terminals:

    100

  • Number of Timers:

    9

  • On Chip Data RAM Width:

    8

  • On Chip Program ROM Width:

    8

  • Operating Temperature-Max:

    105 °C

  • Operating Temperature-Min:

    -40 °C

  • PWM Channels:

    YES

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TFBGA

  • Package Equivalence Code:

    BGA100,10X10,32

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY, THIN PROFILE, FINE PITCH

  • Peak Reflow Temperature (Cel):

    260

  • RAM (bytes):

    368640

  • ROM (words):

    0

  • ROM Programmability:

    OTPROM

  • Seated Height-Max:

    1.2 mm

  • Speed:

    180 MHz

  • Supply Current-Max:

    35 mA

  • Supply Voltage-Max:

    3.6 V

  • Supply Voltage-Min:

    2.7 V

  • Supply Voltage-Nom:

    3.3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Terminal Finish:

    Tin/Silver/Copper (Sn/Ag/Cu)

  • Terminal Form:

    BALL

  • Terminal Pitch:

    0.8 mm

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    9 mm

  • uPs/uCs/Peripheral ICs Type:

    MICROCONTROLLER, RISC

LPC54S016JET100E Frequently Asked Questions (FAQs)

  • The maximum operating temperature range for the LPC54S016JET100E is -40°C to +105°C.
  • The clock settings for the LPC54S016JET100E can be configured using the Clock Control Unit (CCU) registers. The CCU provides a flexible clock generation and distribution system that allows the user to configure the clock sources, dividers, and multiplexers to meet the specific requirements of the application.
  • The maximum current consumption of the LPC54S016JET100E depends on the operating frequency, voltage, and peripherals used. According to the datasheet, the typical current consumption is around 100 mA at 100 MHz and 3.3 V, but it can be as high as 200 mA in certain configurations.
  • The ADC on the LPC54S016JET100E is a 12-bit successive approximation ADC with up to 8 channels. To use the ADC, you need to configure the ADC clock, select the ADC channel, and start the conversion. The ADC result can be read from the ADC register. You can also use the ADC interrupt to trigger an interrupt when the conversion is complete.
  • Yes, the LPC54S016JET100E can be used with an external crystal oscillator. The microcontroller has an on-chip oscillator circuit that can be used with an external crystal or ceramic resonator to generate the clock signal. The external crystal oscillator can be connected to the XTALIN and XTALOUT pins.

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About NXP

NXP Semiconductors is a leading manufacturer of semiconductor devices with a wide range of semiconductor solutions, including microcontrollers, sensors, connectivity solutions, power management ICs, and security solutions. These products are used in a variety of applications such as automotive, industrial automation, smart homes, mobile devices, and more. NXP Semiconductors is one of the world’s largest semiconductor companies and is headquartered in Eindhoven, the Netherlands.

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