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LPC5512JBD100E - NXP

Description: ARM Microcontrollers - MCU High Efficiency Arm Cortex-M33-based Microcontroller

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Symbol
LPC5512JBD100E - NXP - PCB symbol
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PCB Footprints
LPC5512JBD100E - NXP PCB footprint - Quad Flat Packages - Quad Flat Packages - HLQFP100
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3D Models
LPC5512JBD100E - NXP - 3D model - Quad Flat Packages - HLQFP100
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LPC5512JBD100E Details

  • Manufacturer Part Number:

    LPC5512JBD100E

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Country Of Origin:

    Taiwan

  • ECCN Code:

    3A991.A.2

  • HTS Code:

    8542.31.00.25

  • Manufacturer:

    NXP Semiconductors

  • YTEOL:

    9

  • Has ADC:

    YES

  • Bit Size:

    32

  • Boundary Scan:

    NO

  • CPU Family:

    CORTEX-M33

  • Clock Frequency-Max:

    32 MHz

  • DAC Channels:

    NO

  • DMA Channels:

    YES

  • JESD-30 Code:

    S-PQFP-G100

  • JESD-609 Code:

    e3

  • Length:

    14 mm

  • Moisture Sensitivity Level:

    3

  • Number of I/O Lines:

    64

  • Number of Terminals:

    100

  • On Chip Program ROM Width:

    8

  • Operating Temperature-Max:

    105 °C

  • Operating Temperature-Min:

    -40 °C

  • PWM Channels:

    YES

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    LFQFP

  • Package Shape:

    SQUARE

  • Package Style:

    FLATPACK, LOW PROFILE, FINE PITCH

  • Peak Reflow Temperature (Cel):

    260

  • RAM (bytes):

    49152

  • ROM (words):

    65536

  • ROM Programmability:

    FLASH

  • Seated Height-Max:

    1.6 mm

  • Speed:

    150 MHz

  • Supply Voltage-Max:

    3.6 V

  • Supply Voltage-Min:

    3 V

  • Supply Voltage-Nom:

    3 V

  • Surface Mount:

    YES

  • Terminal Finish:

    Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    QUAD

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    14 mm

  • uPs/uCs/Peripheral ICs Type:

    MICROCONTROLLER, RISC

LPC5512JBD100E Frequently Asked Questions (FAQs)

  • The maximum operating temperature range for the LPC5512JBD100E is -40°C to 105°C.
  • The clock settings for the LPC5512JBD100E can be configured using the Clock Control Unit (CCU) registers. The CCU provides a flexible clock tree that allows the user to configure the clock sources, dividers, and multiplexers to generate the desired clock frequencies for the various peripherals and domains.
  • The maximum current consumption of the LPC5512JBD100E depends on the operating frequency, voltage, and peripheral usage. According to the datasheet, the maximum current consumption is approximately 350 mA at 100 MHz and 3.3 V.
  • The LPC5512JBD100E has a built-in TrustZone security feature that provides a secure environment for executing sensitive code and storing sensitive data. To use TrustZone, you need to configure the Secure Attribution Unit (SAU) and the TrustZone controller (TZC) registers to define the secure and non-secure regions of the device.
  • Yes, the LPC5512JBD100E can be used with an external crystal oscillator. The device has an on-chip oscillator that can be used to drive an external crystal oscillator, which can provide a more accurate clock source for the device.

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LPC5512JBD100E Overview

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About NXP

NXP Semiconductors is a leading manufacturer of semiconductor devices with a wide range of semiconductor solutions, including microcontrollers, sensors, connectivity solutions, power management ICs, and security solutions. These products are used in a variety of applications such as automotive, industrial automation, smart homes, mobile devices, and more. NXP Semiconductors is one of the world’s largest semiconductor companies and is headquartered in Eindhoven, the Netherlands.

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