LPC810M021FN8FP - NXP

LPC810M021FN8FP Details

• Manufacturer Part Number:

  LPC810M021FN8FP

• Brand Name:

  NXP Semiconductor

• Rohs Code:

  Yes

• Part Life Cycle Code:

  Obsolete

• Part Package Code:

  DIP

• Package Description:

  0.300 INCH, PLASTIC, MO-001, SOT097-2, DIP-8

• Pin Count:

  8

• Manufacturer Package Code:

  SOT97-2

• ECCN Code:

  EAR99

• HTS Code:

  8542.31.00.25

• Factory Lead Time:

  4 Weeks

• Manufacturer:

  NXP Semiconductors

• YTEOL:

  0

• Has ADC:

  NO

• Bit Size:

  32

• Boundary Scan:

  YES

• CPU Family:

  CORTEX-M0

• Clock Frequency-Max:

  25 MHz

• DAC Channels:

  NO

• DMA Channels:

  NO

• JESD-30 Code:

  R-PDIP-T8

• Length:

  9.5 mm

• Number of I/O Lines:

  6

• Number of Terminals:

  8

• On Chip Program ROM Width:

  8

• Operating Temperature-Max:

  105 °C

• Operating Temperature-Min:

  -40 °C

• PWM Channels:

  YES

• Package Body Material:

  PLASTIC/EPOXY

• Package Code:

  DIP

• Package Equivalence Code:

  DIP8,.3

• Package Shape:

  RECTANGULAR

• Package Style:

  IN-LINE

• Qualification Status:

  Not Qualified

• RAM (bytes):

  1024

• ROM (words):

  4096

• ROM Programmability:

  FLASH

• Seated Height-Max:

  4.2 mm

• Speed:

  30 MHz

• Supply Voltage-Max:

  3.6 V

• Supply Voltage-Min:

  3.3 V

• Supply Voltage-Nom:

  3.3 V

• Surface Mount:

  NO

• Technology:

  CMOS

• Temperature Grade:

  INDUSTRIAL

• Terminal Form:

  THROUGH-HOLE

• Terminal Pitch:

  2.54 mm

• Terminal Position:

  DUAL

• Width:

  7.62 mm

• uPs/uCs/Peripheral ICs Type:

  MICROCONTROLLER, RISC