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LPC824M201JDH20J - NXP

Description: ARM Microcontrollers - MCU

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LPC824M201JDH20J - NXP PCB footprint - Small Outline Packages - Small Outline Packages - TSSOP20: plastic thin shrink small
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LPC824M201JDH20J - NXP  - 3D model - Small Outline Packages - TSSOP20: plastic thin shrink small
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LPC824M201JDH20J Details

  • Manufacturer Part Number:

    LPC824M201JDH20J

  • Brand Name:

    NXP Semiconductor

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    TSSOP2

  • Package Description:

    TSSOP-20

  • Pin Count:

    20

  • Manufacturer Package Code:

    SOT360-1

  • Country Of Origin:

    Thailand

  • ECCN Code:

    3A991.A.2

  • HTS Code:

    8542.31.00.25

  • Factory Lead Time:

    13 Weeks

  • Manufacturer:

    NXP Semiconductors

  • YTEOL:

    5

  • Has ADC:

    YES

  • Bit Size:

    32

  • Boundary Scan:

    YES

  • CPU Family:

    CORTEX-M0

  • Clock Frequency-Max:

    25 MHz

  • DAC Channels:

    NO

  • DMA Channels:

    YES

  • Format:

    FIXED POINT

  • Integrated Cache:

    NO

  • JESD-30 Code:

    R-PDSO-G20

  • JESD-609 Code:

    e4

  • Length:

    6.5 mm

  • Low Power Mode:

    YES

  • Moisture Sensitivity Level:

    1

  • Number of DMA Channels:

    18

  • Number of External Interrupts:

    8

  • Number of I/O Lines:

    16

  • Number of Serial I/Os:

    3

  • Number of Terminals:

    20

  • Number of Timers:

    4

  • On Chip Data RAM Width:

    8

  • On Chip Program ROM Width:

    8

  • Operating Temperature-Max:

    105 °C

  • Operating Temperature-Min:

    -40 °C

  • PWM Channels:

    YES

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSSOP

  • Package Equivalence Code:

    TSSOP20,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

  • Peak Reflow Temperature (Cel):

    260

  • RAM (bytes):

    8192

  • ROM (words):

    32768

  • ROM Programmability:

    FLASH

  • Seated Height-Max:

    1.1 mm

  • Speed:

    30 MHz

  • Supply Current-Max:

    100 mA

  • Supply Voltage-Max:

    3.6 V

  • Supply Voltage-Min:

    1.8 V

  • Supply Voltage-Nom:

    3.3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    4.4 mm

  • uPs/uCs/Peripheral ICs Type:

    MICROCONTROLLER, RISC

LPC824M201JDH20J Frequently Asked Questions (FAQs)

  • The maximum operating temperature range for the LPC824M201JDH20J is -40°C to 105°C.
  • The internal oscillator on the LPC824M201JDH20J can be configured using the SYSCON registers. The IRC (Internal RC oscillator) is enabled by default, but can be adjusted using the IRCCTRL register.
  • The maximum clock speed of the LPC824M201JDH20J is 30 MHz.
  • The ADC on the LPC824M201JDH20J is a 12-bit successive approximation ADC. It can be configured using the ADC registers, and triggered using the ADCSTART register.
  • Yes, the LPC824M201JDH20J can be used with an external crystal oscillator. The external oscillator can be connected to the XTALIN and XTALOUT pins, and configured using the SYSCON registers.

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LPC824M201JDH20J Overview

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About NXP

NXP Semiconductors is a leading manufacturer of semiconductor devices with a wide range of semiconductor solutions, including microcontrollers, sensors, connectivity solutions, power management ICs, and security solutions. These products are used in a variety of applications such as automotive, industrial automation, smart homes, mobile devices, and more. NXP Semiconductors is one of the world’s largest semiconductor companies and is headquartered in Eindhoven, the Netherlands.

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