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LPC824M201JHI33 - NXP

Description:  System:  ARM Cortex-M0+ processor (revision r0p1), running at frequencies of up to 30 MHz with single-cycle multiplier and fast single-cycle I/O port.  ARM Cortex-M0+ built-in Nested Vectored Interrupt Controller (NVIC).  System tick timer.  AHB multilayer matrix.  Serial Wire Debug (SWD) with four break points and two watch points. JTAG boundary scan (BSDL) supported.  MTB  Memory:  Up to 32 KB on-chip flash programming memory with 64 Byte page write and erase. Code Read Protection (CR

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LPC824M201JHI33 - NXP PCB footprint - Quad Flat No-Lead - Quad Flat No-Lead - HVQFN32: plastic thermal enhanced very thin quad flat package; no leads; 32 terminals; body 5 x 5 x 0.85
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LPC824M201JHI33 - NXP  - 3D model - Quad Flat No-Lead - HVQFN32: plastic thermal enhanced very thin quad flat package; no leads; 32 terminals; body 5 x 5 x 0.85
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  • Datasheet Download Datasheet
  • Stock & Prices $ Price & Stock for LPC824M201JHI33
  • Part Number LPC824M201JHI33
  • Manufacturer NXP
  • Pin Count 33
  • Part Category Integrated Circuit
  • Package Category Quad Flat No-Lead
  • Footprint Name Quad Flat No-Lead - HVQFN32: plastic thermal enhanced very thin quad flat package; no leads; 32 terminals; body 5 x 5 x 0.85
  • Released Date Mar 19, 2025
  • Last Modified Date Mar 19, 2025 4:01 AM UTC
  • Pinout / Pin List Click Here (Member Only)

LPC824M201JHI33 Details

  • Manufacturer Part Number:

    LPC824M201JHI33

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Country Of Origin:

    Mainland China, Taiwan

  • ECCN Code:

    3A991.A.2

  • HTS Code:

    8542.31.00.25

  • Manufacturer:

    NXP Semiconductors

  • YTEOL:

    5

  • Has ADC:

    YES

  • Bit Size:

    32

  • Clock Frequency-Max:

    25 MHz

  • DAC Channels:

    NO

  • DMA Channels:

    YES

  • JESD-30 Code:

    S-PQCC-N33

  • Length:

    5 mm

  • Number of I/O Lines:

    29

  • Number of Terminals:

    33

  • Operating Temperature-Max:

    105 °C

  • Operating Temperature-Min:

    -40 °C

  • PWM Channels:

    YES

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HVQCCN

  • Package Shape:

    SQUARE

  • Package Style:

    CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

  • ROM Programmability:

    FLASH

  • Seated Height-Max:

    0.85 mm

  • Speed:

    30 MHz

  • Supply Voltage-Max:

    3.6 V

  • Supply Voltage-Min:

    1.8 V

  • Supply Voltage-Nom:

    3.3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    QUAD

  • Width:

    5 mm

  • uPs/uCs/Peripheral ICs Type:

    MICROCONTROLLER, RISC

LPC824M201JHI33 Frequently Asked Questions (FAQs)

  • The maximum operating temperature range for the LPC824M201JHI33 is -40°C to +105°C.
  • The internal oscillator on the LPC824M201JHI33 can be configured using the SYSCON registers. Specifically, the IRC (Internal RC oscillator) can be enabled by setting the IRCEN bit in the SYSCON_IRCCTRL register.
  • Yes, the LPC824M201JHI33 can be used with an external crystal oscillator. The external crystal oscillator can be connected to the XTALIN and XTALOUT pins, and the oscillator mode can be selected using the SYSCON_CLKSRCSEL register.
  • The UART on the LPC824M201JHI33 can be enabled by setting the UARTn_EN bit in the UARTn_CFG register, where n is the UART number (0 or 1). Additionally, the UART pins need to be configured as UART pins using the PINENABLE registers.
  • The maximum baud rate supported by the UART on the LPC824M201JHI33 is 3.125 Mbps.

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LPC824M201JHI33 Overview

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About NXP

NXP Semiconductors is a leading manufacturer of semiconductor devices with a wide range of semiconductor solutions, including microcontrollers, sensors, connectivity solutions, power management ICs, and security solutions. These products are used in a variety of applications such as automotive, industrial automation, smart homes, mobile devices, and more. NXP Semiconductors is one of the world’s largest semiconductor companies and is headquartered in Eindhoven, the Netherlands.

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