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LPC824M201JHI33Y - NXP

Description: MCU 32-bit ARM Cortex M0+ RISC 32KB Flash 2.5V/3.3V 32-Pin HVQFN EP T/R

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PCB Footprints
LPC824M201JHI33Y - NXP PCB footprint - Quad Flat No-Lead - Quad Flat No-Lead - HVQFN32
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3D Models
LPC824M201JHI33Y - NXP  - 3D model - Quad Flat No-Lead - HVQFN32
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LPC824M201JHI33Y Details

  • Manufacturer Part Number:

    LPC824M201JHI33Y

  • Brand Name:

    NXP Semiconductor

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    QFN

  • Package Description:

    5 X 5 MM, 0.85 MM HEIGHT, GREEN, PLASTIC, MO-220, HVQFN-33

  • Pin Count:

    32

  • Manufacturer Package Code:

    SOT617-3

  • Country Of Origin:

    Mainland China, Taiwan

  • ECCN Code:

    3A991.A.2

  • HTS Code:

    8542.31.00.25

  • Factory Lead Time:

    13 Weeks

  • Manufacturer:

    NXP Semiconductors

  • YTEOL:

    5

  • Has ADC:

    YES

  • Additional Feature:

    SEATED HGT-NOM

  • Bit Size:

    32

  • Boundary Scan:

    YES

  • Clock Frequency-Max:

    25 MHz

  • DAC Channels:

    NO

  • DMA Channels:

    YES

  • JESD-30 Code:

    S-PQCC-N33

  • Length:

    5 mm

  • Moisture Sensitivity Level:

    3

  • Number of I/O Lines:

    29

  • Number of Terminals:

    33

  • On Chip Program ROM Width:

    8

  • Operating Temperature-Max:

    105 °C

  • Operating Temperature-Min:

    -40 °C

  • PWM Channels:

    YES

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HVQCCN

  • Package Shape:

    SQUARE

  • Package Style:

    CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

  • Peak Reflow Temperature (Cel):

    260

  • RAM (bytes):

    8192

  • ROM (words):

    32768

  • ROM Programmability:

    FLASH

  • Seated Height-Max:

    0.85 mm

  • Speed:

    30 MHz

  • Supply Voltage-Max:

    3.6 V

  • Supply Voltage-Min:

    3.3 V

  • Supply Voltage-Nom:

    3.3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    QUAD

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    5 mm

  • uPs/uCs/Peripheral ICs Type:

    MICROCONTROLLER, RISC

LPC824M201JHI33Y Frequently Asked Questions (FAQs)

  • The maximum operating temperature range for the LPC824M201JHI33Y is -40°C to 105°C.
  • The internal oscillator on the LPC824M201JHI33Y can be configured using the SYSCON registers. The IRC (Internal RC oscillator) is enabled by default, but can be adjusted using the IRCCTRL register.
  • The maximum clock speed of the LPC824M201JHI33Y is 30 MHz.
  • The ADC on the LPC824M201JHI33Y is a 12-bit successive approximation ADC. It can be configured using the ADC registers, and triggered using the ADCSTART register.
  • Yes, the LPC824M201JHI33Y can be used with an external crystal oscillator. The external oscillator is connected to the XTALIN and XTALOUT pins, and can be configured using the SYSCON registers.

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LPC824M201JHI33Y Overview

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About NXP

NXP Semiconductors is a leading manufacturer of semiconductor devices with a wide range of semiconductor solutions, including microcontrollers, sensors, connectivity solutions, power management ICs, and security solutions. These products are used in a variety of applications such as automotive, industrial automation, smart homes, mobile devices, and more. NXP Semiconductors is one of the world’s largest semiconductor companies and is headquartered in Eindhoven, the Netherlands.

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