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LPC845M301JBD64E - NXP

Description: NXP - LPC845M301JBD64E - MCU, ARM CORTEX-M0+, 30MHZ, LQFP-64

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LPC845M301JBD64E - NXP PCB footprint - Quad Flat Packages - Quad Flat Packages - LQFP (10x10x1.4)-1
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LPC845M301JBD64E - NXP  - 3D model - Quad Flat Packages - LQFP (10x10x1.4)-1
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LPC845M301JBD64E Details

  • Manufacturer Part Number:

    LPC845M301JBD64E

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    LQFP-64

  • Country Of Origin:

    Taiwan

  • ECCN Code:

    3A991.A.2

  • HTS Code:

    8542.31.00.25

  • Manufacturer:

    NXP Semiconductors

  • YTEOL:

    6

  • Has ADC:

    YES

  • Bit Size:

    32

  • Boundary Scan:

    YES

  • CPU Family:

    Cortex-M0+

  • Clock Frequency-Max:

    25 MHz

  • DAC Channels:

    YES

  • DMA Channels:

    YES

  • Format:

    FIXED POINT

  • Integrated Cache:

    NO

  • JESD-30 Code:

    S-PQFP-G64

  • JESD-609 Code:

    e3

  • Length:

    10 mm

  • Low Power Mode:

    YES

  • Moisture Sensitivity Level:

    3

  • Number of DMA Channels:

    25

  • Number of External Interrupts:

    8

  • Number of I/O Lines:

    54

  • Number of Serial I/Os:

    5

  • Number of Terminals:

    64

  • Number of Timers:

    8

  • On Chip Data RAM Width:

    8

  • On Chip Program ROM Width:

    8

  • Operating Temperature-Max:

    105 °C

  • Operating Temperature-Min:

    -40 °C

  • PWM Channels:

    YES

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    LFQFP

  • Package Equivalence Code:

    QFP64,.47SQ,20

  • Package Shape:

    SQUARE

  • Package Style:

    FLATPACK, LOW PROFILE, FINE PITCH

  • Peak Reflow Temperature (Cel):

    260

  • RAM (bytes):

    16384

  • ROM (words):

    65536

  • ROM Programmability:

    FLASH

  • Seated Height-Max:

    1.6 mm

  • Speed:

    30 MHz

  • Supply Current-Max:

    100 mA

  • Supply Voltage-Max:

    3.6 V

  • Supply Voltage-Min:

    1.8 V

  • Supply Voltage-Nom:

    3.3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Terminal Finish:

    Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    QUAD

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    10 mm

  • uPs/uCs/Peripheral ICs Type:

    MICROCONTROLLER, RISC

LPC845M301JBD64E Frequently Asked Questions (FAQs)

  • The maximum operating temperature range for the LPC845M301JBD64E is -40°C to 105°C.
  • The clock source for the LPC845M301JBD64E can be configured using the Clock Control Unit (CCU) registers. The CCU allows selection of the clock source, clock frequency, and clock mode.
  • The maximum current consumption of the LPC845M301JBD64E is approximately 120 mA at 3.3V and 48 MHz.
  • The ADC on the LPC845M301JBD64E can be used by configuring the ADC registers, selecting the ADC channel, and starting the ADC conversion. The ADC result can be read from the ADC result register.
  • Yes, the LPC845M301JBD64E can be used with an external crystal oscillator. The external crystal oscillator can be connected to the XTALIN and XTALOUT pins, and the clock source can be configured to use the external crystal oscillator.

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LPC845M301JBD64E Overview

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About NXP

NXP Semiconductors is a leading manufacturer of semiconductor devices with a wide range of semiconductor solutions, including microcontrollers, sensors, connectivity solutions, power management ICs, and security solutions. These products are used in a variety of applications such as automotive, industrial automation, smart homes, mobile devices, and more. NXP Semiconductors is one of the world’s largest semiconductor companies and is headquartered in Eindhoven, the Netherlands.

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