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LPC845M301JHI33E - NXP

Description: NXP - LPC845M301JHI33E - 32-BIT ARM CORTEX-M0+, TRAY SINGLE DP BAKEABLE, TRAY ROHS COMPLIANT: YES

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PCB Footprints
LPC845M301JHI33E - NXP PCB footprint - Quad Flat No-Lead - Quad Flat No-Lead - SOT617-11
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3D Models
LPC845M301JHI33E - NXP  - 3D model - Quad Flat No-Lead - SOT617-11
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LPC845M301JHI33E Details

  • Manufacturer Part Number:

    LPC845M301JHI33E

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    HVQFN-33

  • Country Of Origin:

    Taiwan

  • ECCN Code:

    3A991.A.2

  • HTS Code:

    8542.31.00.25

  • Manufacturer:

    NXP Semiconductors

  • YTEOL:

    6

  • Has ADC:

    YES

  • Bit Size:

    32

  • Boundary Scan:

    YES

  • CPU Family:

    Cortex-M0+

  • Clock Frequency-Max:

    25 MHz

  • DAC Channels:

    YES

  • DMA Channels:

    YES

  • Format:

    FIXED POINT

  • Integrated Cache:

    NO

  • JESD-30 Code:

    S-PQCC-N33

  • Length:

    5 mm

  • Low Power Mode:

    YES

  • Moisture Sensitivity Level:

    3

  • Number of DMA Channels:

    25

  • Number of External Interrupts:

    8

  • Number of I/O Lines:

    29

  • Number of Serial I/Os:

    5

  • Number of Terminals:

    33

  • Number of Timers:

    8

  • On Chip Data RAM Width:

    8

  • On Chip Program ROM Width:

    8

  • Operating Temperature-Max:

    105 °C

  • Operating Temperature-Min:

    -40 °C

  • PWM Channels:

    YES

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HVQCCN

  • Package Equivalence Code:

    LCC33,.2SQ,20

  • Package Shape:

    SQUARE

  • Package Style:

    CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

  • Peak Reflow Temperature (Cel):

    260

  • RAM (bytes):

    16384

  • ROM (words):

    65536

  • ROM Programmability:

    FLASH

  • Seated Height-Max:

    0.85 mm

  • Speed:

    30 MHz

  • Supply Current-Max:

    50 mA

  • Supply Voltage-Max:

    3.6 V

  • Supply Voltage-Min:

    1.8 V

  • Supply Voltage-Nom:

    3.3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    QUAD

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    5 mm

  • uPs/uCs/Peripheral ICs Type:

    MICROCONTROLLER, RISC

LPC845M301JHI33E Frequently Asked Questions (FAQs)

  • The maximum operating temperature range for the LPC845M301JHI33E is -40°C to 105°C.
  • The clock settings for the LPC845M301JHI33E can be configured using the Clock Control Unit (CCU) registers. The CCU provides a flexible clock generation and distribution system that allows the user to configure the clock frequencies and sources for the various peripherals and CPU.
  • The maximum current consumption of the LPC845M301JHI33E is approximately 120 mA at 3.3V and 48 MHz CPU frequency.
  • The ADC on the LPC845M301JHI33E is a 12-bit successive approximation ADC with up to 8 channels. To use the ADC, the user needs to configure the ADC clock, select the ADC channel, and start the ADC conversion. The ADC result can be read from the ADC result register.
  • Yes, the LPC845M301JHI33E can be used with an external crystal oscillator. The microcontroller has an on-chip oscillator circuit that can be connected to an external crystal or ceramic resonator to generate the clock signal.

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LPC845M301JHI33E Overview

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About NXP

NXP Semiconductors is a leading manufacturer of semiconductor devices with a wide range of semiconductor solutions, including microcontrollers, sensors, connectivity solutions, power management ICs, and security solutions. These products are used in a variety of applications such as automotive, industrial automation, smart homes, mobile devices, and more. NXP Semiconductors is one of the world’s largest semiconductor companies and is headquartered in Eindhoven, the Netherlands.

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