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LPWI252010H2R2T - LITTELFUSE

Description: Fixed Inductors

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LPWI252010H2R2T - LITTELFUSE PCB footprint - Inductors Chip - Inductors Chip - LPWI252010H2R2T
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LPWI252010H2R2T - LITTELFUSE  - 3D model - Inductors Chip - LPWI252010H2R2T
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LPWI252010H2R2T Details

  • Manufacturer Part Number:

    LPWI252010H2R2T

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    CHIP

  • ECCN Code:

    EAR99

  • HTS Code:

    8504.50.80.00

  • Manufacturer:

    Littelfuse Inc

  • YTEOL:

    7.4

  • Case/Size Code:

    1008

  • Construction:

    Rectangular

  • Core Material:

    METAL COMPOSITE

  • DC Resistance:

    0.097 Ω

  • Inductance-Nom (L):

    2.2 µH

  • Inductor Application:

    POWER INDUCTOR

  • Inductor Type:

    GENERAL PURPOSE INDUCTOR

  • Number of Functions:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Height:

    1 mm

  • Package Length:

    2.5 mm

  • Package Style:

    SMT

  • Package Width:

    2 mm

  • Packing Method:

    TR, 7 Inch

  • Rated Current-Max:

    2.3 A

  • Shape/Size Description:

    RECTANGULAR PACKAGE

  • Shielded:

    YES

  • Surface Mount:

    YES

  • Terminal Placement:

    DUAL ENDED

  • Terminal Shape:

    WRAPAROUND

  • Test Frequency:

    1 MHz

  • Tolerance:

    20%

LPWI252010H2R2T Frequently Asked Questions (FAQs)

  • A recommended PCB layout for LPWI252010H2R2T includes a solid ground plane, short and wide traces for low impedance, and a thermal relief pattern for efficient heat dissipation. It's also recommended to follow the manufacturer's recommended land pattern and keep the component away from high-voltage areas.
  • To ensure reliability in high-temperature applications, it's essential to follow the recommended derating curves, ensure proper thermal management, and consider the device's thermal resistance. Additionally, using a thermally conductive material, such as a heat sink or thermal pad, can help to dissipate heat efficiently.
  • When using LPWI252010H2R2T in a high-frequency circuit, it's essential to consider the device's parasitic inductance and capacitance, which can affect the circuit's performance. A good understanding of the device's high-frequency characteristics and proper PCB layout design can help to minimize these effects.
  • While LPWI252010H2R2T is designed to handle high currents, it's crucial to ensure that the device is properly cooled and that the PCB is designed to handle the high current. Additionally, the device's current rating should be derated according to the ambient temperature and other environmental factors.
  • To troubleshoot issues with LPWI252010H2R2T, start by verifying the device's pinout and ensuring that it's properly soldered to the PCB. Check for any signs of overheating, and verify that the device is operating within its recommended specifications. Use oscilloscopes and other diagnostic tools to identify any anomalies in the circuit.

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LPWI252010H2R2T Overview

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