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LR1F330K - TE Connectivity

Description: Body Features: Lead Type Axial-Leaded | Configuration Features: Number of Resistors 1 | Dimensions: Passive Component Dimensions 6.2 x 2.3 MM | Electrical Characteristics: Operating Voltage 350 V | Passive Component Tolerance 1 PCT | Resistance Class 1kΩ – 1MΩ | Power Rating .6 WATT | Resistance Value 330K OHM | Packaging Features: Packaging Method Ammo Packed | Product Type Features: Element Type Thin Film | Resistor Type General Purpose Resistor | Termination Features: Termination Area Base Material C

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PCB Footprints
LR1F330K - TE Connectivity PCB footprint - Resistors, Axial Diameter Horizontal Mounting - Resistors, Axial Diameter Horizontal Mounting - LR1
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3D Models
LR1F330K - TE Connectivity  - 3D model - Resistors, Axial Diameter Horizontal Mounting - LR1
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LR1F330K Details

  • Manufacturer Part Number:

    LR1F330K

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    AXIAL LEADED

  • Reach Compliance Code:

    Compliant

  • ECCN Code:

    EAR99

  • HTS Code:

    8533.21.00.90

  • Factory Lead Time:

    11 Weeks, 1 Day

  • Manufacturer:

    TE Connectivity

  • YTEOL:

    8

  • Additional Feature:

    PRECISION

  • Construction:

    Tubular

  • JESD-609 Code:

    e3

  • Lead Diameter:

    0.55 mm

  • Mounting Feature:

    THROUGH HOLE MOUNT

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    155 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Diameter:

    2.3 mm

  • Package Length:

    6.2 mm

  • Package Shape:

    TUBULAR PACKAGE

  • Package Style:

    Axial

  • Packing Method:

    AMMO PACK

  • Physical Dimension:

    6.2mm x 2.3mm

  • Rated Power Dissipation (P):

    0.6 W

  • Rated Temperature:

    70 °C

  • Resistance:

    330000 Ω

  • Resistor Type:

    FIXED RESISTOR

  • Surface Mount:

    NO

  • Technology:

    THIN FILM

  • Temperature Coefficient:

    50 ppm/°C

  • Terminal Finish:

    Tin (Sn)

  • Terminal Shape:

    WIRE

  • Tolerance:

    1%

  • Working Voltage:

    350 V

LR1F330K Frequently Asked Questions (FAQs)

  • TE Connectivity provides a recommended PCB layout and land pattern in their application note AN-1043, which can be found on their website. It's essential to follow this layout to ensure proper thermal performance and to prevent overheating.
  • To ensure reliability in high-vibration environments, it's crucial to follow proper mounting and soldering techniques. TE Connectivity recommends using a strain relief mechanism, such as a cable tie or a clamp, to secure the component to the PCB. Additionally, using a solder with a high melting point and ensuring a strong solder joint can help prevent failures.
  • While the datasheet specifies an operating temperature range of -40°C to 150°C, it's essential to note that the component's performance may degrade at extreme temperatures. TE Connectivity recommends derating the component's power rating at high temperatures to ensure reliable operation.
  • The LR1F330K is not designed for use in high-humidity environments. If your application requires operation in humid conditions, you should consider using a component with a higher moisture sensitivity level (MSL) rating or take additional precautions, such as conformal coating or hermetic sealing, to protect the component.
  • To prevent damage and ensure reliability, it's essential to store the LR1F330K in a dry, cool place, away from direct sunlight and moisture. TE Connectivity recommends following the IPC/JEDEC J-STD-033 standard for handling and storage of moisture-sensitive devices.

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LR1F330K Overview

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About TE Connectivity

TE Connectivity, a global leader in connectivity and sensor solutions, designs and manufactures products that enable a more connected world. Serving a diverse range of industries, including automotive, industrial, medical, aerospace, and telecommunications, TE Connectivity offers a broad portfolio of products such as connectors, sensors, relays, and passive components. The company's innovations help improve the reliability and performance of electronic systems.

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