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LS03-K3B12SS - Mornsun Power

Description: Open Frame AC DC Converters 1 Output 12V 250mA 85 ~ 305 VAC, 70 ~ 430 VDC Input

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PCB Footprints
LS03-K3B12SS - Mornsun Power PCB footprint - Other - Other - LS03-K3B12SS-1
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3D Models
LS03-K3B12SS - Mornsun Power  - 3D model - Other - LS03-K3B12SS-1
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LS03-K3B12SS Details

  • Manufacturer Part Number:

    LS03-K3B12SS

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    PACKAGE-4

  • ECCN Code:

    EAR99

  • Manufacturer:

    MORNSUN

  • YTEOL:

    6

  • Additional Feature:

    70 TO 430 VDC INPUT AVAILABLE; WIDTH MAX CONSIDERED

  • Analog IC - Other Type:

    AC-DC REGULATED POWER SUPPLY MODULE

  • Approvals:

    BS, CE, EN, IEC, UKCA, UL

  • Efficiency (Main Output):

    73%

  • Input Voltage-Max:

    305 V

  • Input Voltage-Min:

    85 V

  • Input Voltage-Nom:

    115 V

  • JESD-30 Code:

    R-XSMA-T4

  • Length:

    16.13 mm

  • Line Regulation-Max:

    1%

  • Load Regulation-Max:

    2%

  • Number of Functions:

    1

  • Number of Outputs:

    1

  • Number of Terminals:

    4

  • Operating Temperature-Max:

    80 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Current-Max:

    0.25 A

  • Output Voltage-Max:

    12.96 V

  • Output Voltage-Min:

    11.4 V

  • Output Voltage-Nom:

    12 V

  • Package Body Material:

    UNSPECIFIED

  • Package Code:

    SMA

  • Package Shape:

    RECTANGULAR

  • Package Style:

    MICROELECTRONIC ASSEMBLY

  • Peak Reflow Temperature (Cel):

    NOT SPECIFIED

  • Protections:

    OUTPUT OVER CURRENT; OUTPUT SHORT CIRCUIT

  • Ripple Voltage (Main Out):

    0.053025 Vrms

  • Screening Level:

    IEC/EN/UL 62368-1

  • Seated Height-Max:

    16.1 mm

  • Surface Mount:

    NO

  • Technology:

    HYBRID

  • Terminal Form:

    THROUGH-HOLE

  • Terminal Position:

    SINGLE

  • Time@Peak Reflow Temperature-Max (s):

    NOT SPECIFIED

  • Total Power Output-Max:

    3 W

  • Trim/Adjustable Output:

    NO

  • Width:

    9.5 mm

LS03-K3B12SS Frequently Asked Questions (FAQs)

  • MORNSUN recommends a PCB layout with a large copper area connected to the GND pin for heat dissipation. A minimum of 1 oz copper thickness is recommended. Additionally, keeping the PCB layer stack-up symmetrical and using thermal vias can help to reduce thermal resistance.
  • To ensure reliable operation in high-temperature environments, it's essential to follow the recommended derating curves for output power and input voltage. Additionally, consider using a heat sink or thermal interface material to reduce the junction temperature. MORNSUN also recommends using a suitable enclosure and ensuring good airflow around the device.
  • MORNSUN recommends using a low-ESR ceramic capacitor with a value of 10uF to 22uF, rated for the input voltage range. The capacitor should be placed as close as possible to the VIN pin to minimize noise and ripple.
  • Yes, the LS03-K3B12SS can be used in a redundant or parallel configuration, but it's essential to follow MORNSUN's guidelines for synchronization and current sharing. Additionally, ensure that the output voltage and current ratings are not exceeded, and that the system is designed to handle the increased power dissipation.
  • The typical efficiency of the LS03-K3B12SS is around 85% to 90% depending on the input voltage, output voltage, and load conditions. Refer to the datasheet for detailed efficiency curves and calculations.

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LS03-K3B12SS Overview

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