LS1017AXE7PQA - NXP

LS1017AXE7PQA Details

• Manufacturer Part Number:

  LS1017AXE7PQA

• Rohs Code:

  Yes

• Part Life Cycle Code:

  Active

• Package Description:

  FCBGA-448

• ECCN Code:

  5A002.A.1

• HTS Code:

  8542.31.00.01

• Manufacturer:

  NXP Semiconductors

• YTEOL:

  7

• JESD-30 Code:

  S-PBGA-B448

• Length:

  17 mm

• Moisture Sensitivity Level:

  3

• Number of Terminals:

  448

• Operating Temperature-Max:

  105 °C

• Operating Temperature-Min:

  -40 °C

• Package Body Material:

  PLASTIC/EPOXY

• Package Code:

  FBGA

• Package Equivalence Code:

  BGA448,30X30,30

• Package Shape:

  SQUARE

• Package Style:

  GRID ARRAY, FINE PITCH

• Peak Reflow Temperature (Cel):

  260

• Seated Height-Max:

  2.61 mm

• Supply Voltage-Max:

  1.03 V

• Supply Voltage-Min:

  0.97 V

• Supply Voltage-Nom:

  1 V

• Surface Mount:

  YES

• Technology:

  CMOS

• Temperature Grade:

  INDUSTRIAL

• Terminal Finish:

  Tin/Silver/Copper (Sn/Ag/Cu)

• Terminal Form:

  BALL

• Terminal Pitch:

  0.75 mm

• Terminal Position:

  BOTTOM

• Time@Peak Reflow Temperature-Max (s):

  40

• Width:

  17 mm

• uPs/uCs/Peripheral ICs Type:

  SoC