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LS1023AXE7QQB - NXP

Description: Microprocessors - MPU QorIQ, 2xCPU 64-Bit ARM Arch, 1.6GHz, DDR3L/4, PCIe, 1/10GbE, HW Accel, SEC, -40 105C, 21x21 pkg

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Symbol
LS1023AXE7QQB - NXP - PCB symbol
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PCB Footprints
LS1023AXE7QQB - NXP PCB footprint - BGA - BGA - SOT1661-1-1
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3D Models
LS1023AXE7QQB - NXP - 3D model - BGA - SOT1661-1-1
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LS1023AXE7QQB Details

  • Manufacturer Part Number:

    LS1023AXE7QQB

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    FCBGA-621

  • ECCN Code:

    5A002.A.1

  • HTS Code:

    8542.31.00.01

  • Factory Lead Time:

    18 Weeks

  • Manufacturer:

    NXP Semiconductors

  • YTEOL:

    9

  • Additional Feature:

    ALSO OPERATES AT 1V SUPPLY NOM

  • JESD-30 Code:

    S-PBGA-B621

  • Length:

    21 mm

  • Moisture Sensitivity Level:

    3

  • Number of Terminals:

    621

  • Operating Temperature-Max:

    105 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    FBGA

  • Package Equivalence Code:

    BGA621,25X25,32

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY, FINE PITCH

  • Peak Reflow Temperature (Cel):

    250

  • Seated Height-Max:

    2.07 mm

  • Supply Voltage-Max:

    0.93 V

  • Supply Voltage-Min:

    0.87 V

  • Supply Voltage-Nom:

    0.9 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Terminal Finish:

    Tin/Silver/Copper (Sn/Ag/Cu)

  • Terminal Form:

    BALL

  • Terminal Pitch:

    0.8 mm

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    21 mm

  • uPs/uCs/Peripheral ICs Type:

    SoC

LS1023AXE7QQB Frequently Asked Questions (FAQs)

  • The recommended power-on sequence is to power up the core voltage (VDD_CORE) first, followed by the I/O voltage (VDD_IO). This ensures that the internal voltage regulators are properly enabled before the I/Os are powered up.
  • The DDR memory interface on the LS1023AXE7QQB is configured using the DDR Controller (DDRC) registers. The DDRC is programmed to select the DDR type, frequency, and timing parameters. Refer to the LS1023AXE7QQB reference manual for detailed configuration information.
  • The maximum operating frequency of the LS1023AXE7QQB is 1.2 GHz. However, the actual operating frequency may be limited by the specific use case, thermal design, and power consumption requirements.
  • Secure boot on the LS1023AXE7QQB is implemented using the Boot ROM and the Security Engine. The Boot ROM verifies the authenticity of the boot image using digital signatures, and the Security Engine provides cryptographic acceleration for secure boot and runtime security.
  • The LS1023AXE7QQB has multiple power modes to optimize power consumption and performance. Sleep mode reduces power consumption by powering down unused peripherals. Standby mode powers down the core and peripherals, while shutdown mode completely powers down the device. Each mode is used to achieve a specific power-saving goal.

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LS1023AXE7QQB Overview

Use the download button to access the LS1023AXE7QQB schematic symbol, PCB footprint, and 3D model.
To find more CAD model downloads similar to this part, try a partial part number search, like LS102, or try a keyword search, such as Other uPs/uCs/Peripheral ICs

About NXP

NXP Semiconductors is a leading manufacturer of semiconductor devices with a wide range of semiconductor solutions, including microcontrollers, sensors, connectivity solutions, power management ICs, and security solutions. These products are used in a variety of applications such as automotive, industrial automation, smart homes, mobile devices, and more. NXP Semiconductors is one of the world’s largest semiconductor companies and is headquartered in Eindhoven, the Netherlands.

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