LS1024ASE7MLA - NXP

LS1024ASE7MLA Details

• Manufacturer Part Number:

  LS1024ASE7MLA

• Pbfree Code:

  Yes

• Rohs Code:

  Yes

• Part Life Cycle Code:

  Obsolete

• Package Description:

  BGA-625

• ECCN Code:

  5A002.A.1

• HTS Code:

  8542.31.00.01

• Manufacturer:

  NXP Semiconductors

• YTEOL:

  0

• Address Bus Width:

  26

• Boundary Scan:

  YES

• Clock Frequency-Max:

  1200 MHz

• JESD-30 Code:

  S-PBGA-B625

• Length:

  21 mm

• Moisture Sensitivity Level:

  3

• Number of Terminals:

  625

• Operating Temperature-Max:

  70 °C

• Operating Temperature-Min:

  -10 °C

• Package Body Material:

  PLASTIC/EPOXY

• Package Code:

  FBGA

• Package Equivalence Code:

  BGA625,25X25,32

• Package Shape:

  SQUARE

• Package Style:

  GRID ARRAY, FINE PITCH

• Peak Reflow Temperature (Cel):

  250

• Seated Height-Max:

  2.67 mm

• Supply Current-Max:

  1500 mA

• Supply Voltage-Max:

  1.164 V

• Supply Voltage-Min:

  1.096 V

• Supply Voltage-Nom:

  1.13 V

• Surface Mount:

  YES

• Technology:

  CMOS

• Temperature Grade:

  COMMERCIAL

• Terminal Form:

  BALL

• Terminal Pitch:

  0.8 mm

• Terminal Position:

  BOTTOM

• Time@Peak Reflow Temperature-Max (s):

  30

• Width:

  21 mm

• uPs/uCs/Peripheral ICs Type:

  MULTIFUNCTION PERIPHERAL