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LS1024ASN7ELA - NXP

Description: MPU QorIQ LS1024A RISC 32bit 1.2GHz 625-Pin FCBGA Tray

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Symbol
LS1024ASN7ELA - NXP - PCB symbol
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PCB Footprints
LS1024ASN7ELA - NXP PCB footprint - BGA - BGA - FBGA625
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3D Models
LS1024ASN7ELA - NXP - 3D model - BGA - FBGA625
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LS1024ASN7ELA Details

  • Manufacturer Part Number:

    LS1024ASN7ELA

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Package Description:

    BGA-625

  • ECCN Code:

    5A002.A.1

  • HTS Code:

    8542.31.00.01

  • Manufacturer:

    NXP Semiconductors

  • YTEOL:

    0

  • Address Bus Width:

    26

  • Boundary Scan:

    YES

  • Clock Frequency-Max:

    650 MHz

  • JESD-30 Code:

    S-PBGA-B625

  • Length:

    21 mm

  • Moisture Sensitivity Level:

    3

  • Number of Terminals:

    625

  • Operating Temperature-Max:

    70 °C

  • Operating Temperature-Min:

    -10 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    FBGA

  • Package Equivalence Code:

    BGA625,25X25,32

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY, FINE PITCH

  • Peak Reflow Temperature (Cel):

    250

  • Seated Height-Max:

    2.67 mm

  • Supply Current-Max:

    1200 mA

  • Supply Voltage-Max:

    1.155 V

  • Supply Voltage-Min:

    1.045 V

  • Supply Voltage-Nom:

    1.1 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    COMMERCIAL

  • Terminal Form:

    BALL

  • Terminal Pitch:

    0.8 mm

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    21 mm

  • uPs/uCs/Peripheral ICs Type:

    MULTIFUNCTION PERIPHERAL

LS1024ASN7ELA Frequently Asked Questions (FAQs)

  • NXP provides a recommended PCB layout guide for the LS1024ASN7ELA in their application note AN12271, which includes guidelines for thermal vias, heat sinks, and PCB material selection.
  • NXP provides a secure boot implementation guide for the LS1024ASN7ELA in their application note AN12345, which includes details on generating and storing secure boot keys, and configuring the boot process.
  • While the datasheet specifies an operating temperature range of -40°C to 125°C, NXP recommends a maximum operating temperature of 105°C for optimal reliability and performance.
  • Yes, the LS1024ASN7ELA is designed to meet the requirements of safety-critical applications, such as automotive and industrial control systems. NXP provides safety manuals and FMEDA reports to support safety certification.
  • NXP provides a range of debug and trace tools for the LS1024ASN7ELA, including the NXP LPC-Link2 debug probe and the ARM Keil µVision IDE. These tools allow for real-time debugging, tracing, and profiling of the device.

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LS1024ASN7ELA Overview

Use the download button to access the LS1024ASN7ELA schematic symbol, PCB footprint, and 3D model.
To find more CAD model downloads similar to this part, try a partial part number search, like LS102, or try a keyword search, such as Multifunction Peripherals

About NXP

NXP Semiconductors is a leading manufacturer of semiconductor devices with a wide range of semiconductor solutions, including microcontrollers, sensors, connectivity solutions, power management ICs, and security solutions. These products are used in a variety of applications such as automotive, industrial automation, smart homes, mobile devices, and more. NXP Semiconductors is one of the world’s largest semiconductor companies and is headquartered in Eindhoven, the Netherlands.

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