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LS1024ASN7JLA - NXP

Description: Microprocessors - MPU 2 cores @ 900MHz PCIe DDR3 VoIP

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Symbol
LS1024ASN7JLA - NXP - PCB symbol
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PCB Footprints
LS1024ASN7JLA - NXP PCB footprint - BGA - BGA - 625 BGA_2020
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3D Models
LS1024ASN7JLA - NXP - 3D model - BGA - 625 BGA_2020
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LS1024ASN7JLA Details

  • Manufacturer Part Number:

    LS1024ASN7JLA

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Package Description:

    BGA-625

  • ECCN Code:

    5A002.A.1

  • HTS Code:

    8542.31.00.01

  • Manufacturer:

    NXP Semiconductors

  • YTEOL:

    0

  • Address Bus Width:

    26

  • Boundary Scan:

    YES

  • Clock Frequency-Max:

    900 MHz

  • JESD-30 Code:

    S-PBGA-B625

  • Length:

    21 mm

  • Moisture Sensitivity Level:

    3

  • Number of Terminals:

    625

  • Operating Temperature-Max:

    70 °C

  • Operating Temperature-Min:

    -10 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    FBGA

  • Package Equivalence Code:

    BGA625,25X25,32

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY, FINE PITCH

  • Peak Reflow Temperature (Cel):

    250

  • Seated Height-Max:

    2.67 mm

  • Supply Current-Max:

    1400 mA

  • Supply Voltage-Max:

    1.155 V

  • Supply Voltage-Min:

    1.045 V

  • Supply Voltage-Nom:

    1.1 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    COMMERCIAL

  • Terminal Form:

    BALL

  • Terminal Pitch:

    0.8 mm

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    21 mm

  • uPs/uCs/Peripheral ICs Type:

    MULTIFUNCTION PERIPHERAL

LS1024ASN7JLA Frequently Asked Questions (FAQs)

  • NXP provides a recommended PCB layout for the LS1024ASN7JLA in the 'PCB Layout Guidelines' document, which can be found on their website. It's essential to follow these guidelines to ensure optimal thermal performance and to prevent overheating.
  • A reliable POR circuit can be implemented using an external voltage supervisor IC, such as the NXP PCA6420, which can detect power-on and power-off conditions and generate a reset signal for the LS1024ASN7JLA. The datasheet provides more information on POR requirements.
  • To ensure EMC and EMI compliance, it's essential to follow proper PCB design practices, such as using a solid ground plane, minimizing signal trace lengths, and using shielding and filtering components as needed. NXP provides EMC and EMI guidelines in their application notes and design guides.
  • To optimize power consumption, use the LS1024ASN7JLA's power-saving features, such as dynamic voltage and frequency scaling, and configure the device to operate in low-power modes when possible. Additionally, optimize the system's clock frequency, use low-power peripherals, and minimize idle time.
  • The LS1024ASN7JLA is manufactured according to NXP's quality and reliability standards, which include ISO/TS 16949 and AEC-Q100. These standards ensure that the device meets specific requirements for reliability, durability, and performance in automotive and industrial applications.

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LS1024ASN7JLA Overview

Use the download button to access the LS1024ASN7JLA schematic symbol, PCB footprint, and 3D model.
To find more CAD model downloads similar to this part, try a partial part number search, like LS102, or try a keyword search, such as Multifunction Peripherals

About NXP

NXP Semiconductors is a leading manufacturer of semiconductor devices with a wide range of semiconductor solutions, including microcontrollers, sensors, connectivity solutions, power management ICs, and security solutions. These products are used in a variety of applications such as automotive, industrial automation, smart homes, mobile devices, and more. NXP Semiconductors is one of the world’s largest semiconductor companies and is headquartered in Eindhoven, the Netherlands.

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