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LS1026ASN8MQA - NXP

Description: Microprocessors - MPU QorIQ Layerscape 2xA72 64Bit ARM-1.2G DDR4-1.6G PCIe 1/10GbE SATA USB 0-105C 23x23pkg 0.9V

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PCB Footprints
LS1026ASN8MQA - NXP PCB footprint - BGA - BGA - SOT1653-1
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LS1026ASN8MQA - NXP  - 3D model - BGA - SOT1653-1
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LS1026ASN8MQA Details

  • Manufacturer Part Number:

    LS1026ASN8MQA

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    FCBGA-780

  • ECCN Code:

    3A991.A.1

  • HTS Code:

    8542.31.00.01

  • Factory Lead Time:

    18 Weeks

  • Manufacturer:

    NXP Semiconductors

  • YTEOL:

    9

  • JESD-30 Code:

    S-PBGA-B780

  • JESD-609 Code:

    e1

  • Length:

    23 mm

  • Moisture Sensitivity Level:

    3

  • Number of Terminals:

    780

  • Operating Temperature-Max:

    105 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    FBGA

  • Package Equivalence Code:

    BGA780,28X28,32

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY, FINE PITCH

  • Peak Reflow Temperature (Cel):

    250

  • Seated Height-Max:

    2.07 mm

  • Supply Voltage-Max:

    0.93 V

  • Supply Voltage-Min:

    0.87 V

  • Supply Voltage-Nom:

    0.9 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Terminal Finish:

    Tin/Silver/Copper (Sn/Ag/Cu)

  • Terminal Form:

    BALL

  • Terminal Pitch:

    0.8 mm

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    23 mm

  • uPs/uCs/Peripheral ICs Type:

    SoC

LS1026ASN8MQA Frequently Asked Questions (FAQs)

  • NXP provides a reference design and layout guidelines in the LS1026A Reference Manual (RM) and the LS1026A Thermal Design Guide. These resources provide detailed information on PCB layout, thermal management, and heat sink design to ensure optimal performance and reliability.
  • To optimize power consumption, use the LS1026A's power management features, such as dynamic voltage and frequency scaling, and configure the processor to run at the lowest possible frequency and voltage required for your application. Additionally, use the LS1026A's low-power modes, such as sleep and standby, to reduce power consumption when the processor is not active.
  • The recommended settings for the LS1026ASN8MQA's DDR memory interface can be found in the LS1026A DDR Memory Interface Application Note. This document provides detailed information on DDR memory configuration, timing, and signal integrity, as well as recommendations for DDR memory selection and layout.
  • To ensure reliable and secure booting, use the LS1026A's secure boot features, such as boot ROM and secure boot firmware. These features provide a secure boot process that authenticates the boot loader and operating system, and ensures that only authorized code is executed. Additionally, use secure storage, such as the LS1026A's One-Time Programmable (OTP) fuses, to store sensitive data, such as cryptographic keys.
  • The limitations and considerations for using the LS1026ASN8MQA's high-speed interfaces, such as PCIe and SATA, can be found in the LS1026A Data Sheet and the LS1026A Interface Application Notes. These documents provide detailed information on interface specifications, signal integrity, and layout considerations, as well as recommendations for interface configuration and testing.

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LS1026ASN8MQA Overview

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About NXP

NXP Semiconductors is a leading manufacturer of semiconductor devices with a wide range of semiconductor solutions, including microcontrollers, sensors, connectivity solutions, power management ICs, and security solutions. These products are used in a variety of applications such as automotive, industrial automation, smart homes, mobile devices, and more. NXP Semiconductors is one of the world’s largest semiconductor companies and is headquartered in Eindhoven, the Netherlands.

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